Contents
page 4
Beckhoff New Automation Technology
CB3052
4.4.1
CPU Feature ....................................................................................................................... 51
4.4.2
Hard Disk Boot Priority ....................................................................................................... 52
4.5
Advanced Chipset Features ....................................................................................................... 53
4.5.1
PCI Express Root Port Function ......................................................................................... 54
4.6
Integrated Peripherals ................................................................................................................ 55
4.6.1
OnChip IDE Devices ........................................................................................................... 56
4.6.2
Onboard Devices ................................................................................................................ 58
4.6.3
SuperIO Devices ................................................................................................................. 59
4.6.4
USB Device Setting ............................................................................................................ 60
4.7
Power Management Setup ......................................................................................................... 61
4.7.1
PCI Express PM Function ................................................................................................... 63
4.7.2
Intel DTS Feature ............................................................................................................... 64
4.8
PnP/PCI Configuration ................................................................................................................ 65
4.8.1
IRQ Resources ................................................................................................................... 67
4.9
PC Health Status ........................................................................................................................ 68
4.10
Frequency/Voltage Control ......................................................................................................... 69
4.11
Load Fail-Safe Defaults .............................................................................................................. 70
4.12
Load Optimized Defaults ............................................................................................................ 70
4.13
Set Password .............................................................................................................................. 70
4.14
Save & Exit Setup ....................................................................................................................... 70
4.15
Exit Without Saving ..................................................................................................................... 70
5
BIOS update ....................................................................................................................................... 71
6
Mechanical Drawings ......................................................................................................................... 72
6.1
PCB: Mounting Holes ................................................................................................................. 72
6.2
PCB: Pin 1 Dimensions .............................................................................................................. 73
6.3
PCB: Heat Sink ........................................................................................................................... 74
7
Technical Data ................................................................................................................................... 75
7.1
Electrical Data ............................................................................................................................. 75
7.2
Environmental Conditions ........................................................................................................... 75
7.3
Thermal Specifications ............................................................................................................... 76
8
Support and Service .......................................................................................................................... 77
8.1
Beckhoff's Branch Offices and Representatives ........................................................................ 77
8.2
Beckhoff Headquarters ............................................................................................................... 77
8.2.1
Beckhoff Support ................................................................................................................ 77
8.2.2
Beckhoff Service ................................................................................................................. 77
I
Annex: Post-Codes ............................................................................................................................ 79
II
Annex: Resources .............................................................................................................................. 82
IO Range ................................................................................................................................................ 82
Memory Range ....................................................................................................................................... 82
Interrupt .................................................................................................................................................. 82
PCI Devices ............................................................................................................................................ 83
SMB Devices .......................................................................................................................................... 83
