Page 26 of 35
May 09, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Figure 7
– Tape and Reel Details
Soldering and Cleaning Recommendations
[ Preliminary
– This information is likely to change ]
Optimum Soldering Reflow Profile
Figure 8
– Recommended Soldering Profile for Lead-Free Solder
Solder joint quality between the AES-MS-MT3620 Azure Sphere Module
’s surface mount pads and
their bonding with the host board should meet the appropriate IPC Specification.
(See
IPC-A-610-D Acceptability of Electronic Assemblies
, section 8.2.1 “
Bottom Only Terminations
”)
It is recommended that only a single reflow soldering process be permitted for the host board
Any attempts at reworking the module will invalidate warrantee coverage and regulatory certifications
Cleaning
Cleaning of the populated module is not recommended!
Residuals under the module cannot be easily removed by any cleaning process
(Water / Solvents / Ultrasonic)