549
8271D–AVR–05/11
ATmega48A/PA/88A/PA/168A/PA/328/P
34.2
32CC1
TITLE
DRAWING NO.
GPC
REV.
Packa
g
e Drawin
g
Contact:
packagedra
w
B
CAG
3
2CC1
, 32-
b
all (6 x 6 Array), 4 x 4 x 0.6 mm
package,
b
all pitch 0.50 mm, Ultra Thin,
Fine-Pitch Ball Grid Array (UFBGA)
32CC1
A – –
0.60
A1 0.12 – –
A2 0.3
8
REF
b
0.25
0.30
0.35
1
b
1 0.25 – – 2
D 3.90
4.00
4.10
D1
2.50 BSC
E 3.90
4.00
4.10
E1
2.50 BSC
e
0.50 BSC
07/06/10
b
1
COMMON DIMEN
S
ION
S
(Unit of Meas
u
re = mm)
1 2
3
4
5
6
B
A
C
D
E
F
E
D
e
32-Ø
b
E
D
B
A
Pin#1 ID
0.0
8
A1
A
D1
E1
A2
A1 BALL COR
N
ER
1 2
3
4
5
6
F
C
S
IDE VIEW
BOTTOM VIEW
TOP VIEW
S
YMBOL
MIN
NOM
MAX
NOTE
N
ote1:
Dimension “b” is measured at the maximum ball dia. in a plane parallel
to the seating plane.
N
ote2:
Dimension “
b
1” is the soldera
b
le s
u
rface defined
b
y the opening of the
solder resist layer.
e