![Asyst Technologies VersaPort 2200 Technical Manual Download Page 43](http://html.mh-extra.com/html/asyst-technologies/versaport-2200/versaport-2200_technical-manual_2993508043.webp)
Released Rev. C
2000-1252-01
Page 25
VersaPort 2200 Technical Manual
Chapter 2: Theory of Operation
VersaPort Components
a
The laser diode, beam splitters, and mirrors are mounted on a laser bracket assembly
that is installed to the bottom of the port plate assembly.
• Wafer Present Sensor, Horizontal View
The laser beam is first directed to a precision beam splitter that reflects a portion
and transmits a portion of the beam. The reflected beam travels across the mid
point of the port opening. On the opposite side of the port door opening, the beam
is directed through an aperture and strikes the wafer sensor. This sensor is used
to furnish positional information about individual wafers. The information is stored
into memory as internal data collected for cassette wafer mapping. The mapping
information is available for use by the Host system to direct the pick and place arm
to accurately retrieve wafers from the VersaPort. This sensor is also used to
determine cross-slotted errors.
• Cassette Slot Sensor
The transmitted laser beam from the first beam splitter is directed at a second
beam splitter. This beam splitter evenly splits the light into two beams. The
reflected beam travels at an angle across the port opening. The beam angle is
aligned to pass on one side of the cassette slot opening as the port plate travels
up or down on the elevator. The beam is projected to the other side of the port
door opening and through an aperture to the cassette slot sensor. The slot
information is available for use by the Host system to direct the pick and place arm
to accurately place wafers back into the cassette.
F
IGURE
7
Laser Detector System
WAFER
PROTRUSION SENSOR
SILICON WAFER
CASSETTE SLOT SENSOR
WAFER PRESENT SENSOR
PARTIAL VIEW OF
CASSETTE SLOTS
BEAMSPLITTER
BEAMSPLITTER
10 mm
FIRST SURFACE
MIRRORS
2
WAFER AT AN
EXCESSIVELY PROTRUDED
POSITION
<1 mW
LASER DIODE
67O NM VISIBLE RED
BREAK-THE-BEAM
INFRARED SENSOR FOR
EXCESSIVE WAFER
PROTRUSION
(Vertical view)
Summary of Contents for VersaPort 2200
Page 2: ......
Page 6: ...Page vi 2000 1252 01 Released Rev C VersaPort 2200 Technical Manual a ...
Page 8: ...VersaPort 2200 Technical Manual Page viii 2000 1252 01 Released Rev C a ...
Page 16: ...Page xvi 2000 1252 01 Released Rev C VersaPort 2200 Technical Manual List of Figures a ...
Page 18: ...Page xviii 2000 1252 01 Released Rev C VersaPort 2200 Technical Manual List of Tables a ...
Page 22: ...Page 4 2000 1252 01 Released Rev C VersaPort 2200 Technical Manual Conventions a ...
Page 227: ......
Page 228: ......
Page 229: ......
Page 230: ......
Page 231: ......
Page 232: ......
Page 233: ......
Page 234: ......
Page 235: ......
Page 236: ......
Page 237: ......
Page 238: ......
Page 239: ......
Page 240: ......
Page 241: ......
Page 242: ......
Page 243: ......
Page 244: ......
Page 245: ......
Page 246: ......
Page 247: ......
Page 248: ......
Page 249: ......
Page 250: ......
Page 251: ......
Page 252: ......
Page 253: ......
Page 254: ......
Page 255: ......
Page 256: ......
Page 257: ......
Page 258: ......
Page 259: ......
Page 260: ......
Page 261: ......
Page 262: ......
Page 263: ......
Page 264: ......
Page 265: ......
Page 266: ......
Page 267: ......
Page 268: ......
Page 269: ......
Page 270: ......
Page 271: ......
Page 272: ......
Page 273: ......
Page 274: ......
Page 275: ......
Page 276: ......
Page 277: ......
Page 278: ......
Page 279: ......
Page 280: ......
Page 281: ......
Page 282: ......
Page 283: ......
Page 284: ......
Page 285: ......
Page 286: ......