Asus P7H55-M BR, (Portuguese) Manual Do Usuário

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ASUS P7H55-M/BR 1-5
Capacidade DDR3-1333MHz DDR3-1333MHz
Vendedor Part No. Tamanho
SS/
DS
Chip
Marca
Chip No.
Timing
DIMM
(BIOS)
Voltage
DIMM
Support
A* B* C*
G.SKILL F3-1�6��CL8D-2GBHK 1�24MB SS G.SKILL Heat-Sink Package - - • • •
G.SKILL F3-1�6��CL9D-2GBPK 1�24MB SS G.SKILL Heat-Sink Package - - • • •
G.SKILL F3-1�666CL7T-3GBPK 3�72MB(Kit of 3) SS - Heat-Sink Package 7-7-7-18 1.5~1.6V • • •
G.SKILL F3-1�6��CL7D-2GBPI(XMP) 1�24MB DS G.SKILL Heat-Sink Package - - • • •
G.SKILL F3-1�6��CL9D-2GBNQ 1�24MB DS G.SKILL Heat-Sink Package - - • • •
G.SKILL F3-1�666CL8D-
4GBECO(XMP)
4�96MB(Kit of 2 ) DS - Heat-Sink Package 8-8-8-
8-24
1.35V(low
voltage)
• • •
G.SKILL F3-1�666CL8D-4GBHK(XMP) 4�96MB(Kit of 2 ) DS - Heat-Sink Package 8-8-8-21 1.5-1.6V • • •
G.SKILL F3-1�666CL7T-6GBPK(XMP) 6144MB(Kit of 3 ) DS - Heat-Sink Package 7-7-7-18 1.5~1.6V • • •
GEIL DDR3-1333 CL9-9-9-24 1�24MB SS - Heat-Sink Package 9 - • • •
GEIL GV34GB1333C7DC 2�48MB DS - Heat-Sink Package 7-7-7-24 1.5V • • •
GEIL GG34GB1333C9DC 4�96MB(Kit of 2) DS GEIL GL1L128M88BA12N 9-9-9-24 1.3V(low
voltage)
• • •
GEIL DDR3-1333 CL9-9-9-24 6144MB(Kit of 3 ) DS - Heat-Sink Package 9 1.5V • • •
Kingmax FLFD45F-B8MF9 1�24MB SS Micron 8HD22D9JNM - - • • •
Kingmax FLFD45F-B8MH9 MAES 1�24MB SS Micron 9CF22D9KPT - - • • •
Kingmax FLFE85F-B8MF9 2�48MB DS Micron 8HD22D9JNM - - • • •
Kingmax FLFE85F-B8MH9 MEES 2�48MB DS Micron 9GF27D9KPT - - • • •
Kingston KVR1333D3N9/1G 1�24MB SS KTC D1288JELDPGD9U - - • • •
Kingston KVR1333D3N9/2G 2�48MB DS Qimonda IDSH1G-�3A1F1C-13H - 1.5V • • •
Kingston KVR1333D3N9/4G 4�96MB DS Hynix H5TQ2G83AFR - - • • •
Micron MT8JTF12864AZ-1G4F1 1�24MB SS Micron 9FF22D9KPT 9 - • • •
Micron MT18JTF25664AZ-1G4F1 2�48MB DS Micron 9KF27D9KPT 9 - • • •
OCZ OCZ3P13332GK 2�48MB(Kit of 2) SS - Heat-Sink Package 7-7-7-2� 1.8V • • •
OCZ OCZ3X1333LV3GK(XMP) 3�72MB(Kit of 3) SS - Heat-Sink Package - 1.6V • • •
OCZ OCZ3G13334GK 4�96MB(Kit of 2) DS - Heat-Sink Package - 1.7V • • •
OCZ OCZ3P13334GK 4�96MB(Kit of 2) DS - Heat-Sink Package 7-7-7-2� 1.8V • • •
OCZ OCZ3P1333LV4GK 4�96MB(Kit of 2) DS - Heat-Sink Package 7-7-7-2� 1.65V • • •
OCZ OCZ3X13334GK(XMP) 4�96MB(Kit of 2) DS - Heat-Sink Package 7-7-7-2� 1.75V • • •
OCZ OCZ3G1333LV6GK 6144MB(Kit of 3 ) DS - Heat-Sink Package 9-9-9-2� 1.65V • • •
OCZ OCZ3P1333LV6GK 6144MB(Kit of 3 ) DS - Heat-Sink Package 7-7-7-2� 1.65V • • •
OCZ OCZ3X1333LV6GK(XMP) 6144MB(Kit of 3 ) DS - Heat-Sink Package 8-8-8-2� 1.6�V • • •
PSC AL7F8G73D-DG1 1�24MB SS PSC A3P1GF3DGF928M9B�5 - - • • •
PSC AL8F8G73D-DG1 2�48MB DS PSC A3P1GF3DGF928M9B�5 - - • • •
SAMSUNG M378B2873DZ1-CH9 1�24MB SS SAMSUNG SEC 846 HCH9
K4B1G�846�
- - • • •
SAMSUNG M378B2873EH1-CH9 1�24MB SS SAMSUNG SEC 913 HCH9
K4B1G�846E
- - • • •
SAMSUNG M378B5673DZ1-CH9 2�48MB DS SAMSUNG K4B1G�846D-HCH9 - - • • •
SAMSUNG M378B5673EH1-CH9 2�48MB DS SAMSUNG SEC 913 HCH9
K4B1G�846E
- - • • •
Transcend TS256MLK64V3U 2�48MB DS Micron 9GF27D9KPT - - • • •
Transcend TS256MLK64V3U 2�48MB DS - SEC816HCH9K4B1G�846D - - • • •
ASINT SLY3128M8-EDJ 1�24MB SS ASINT DDRII12�8-DJ �844 - - • • •
ASINT SLY3128M8-EDJE 1�24MB SS ELPIDA J11�8BASE-DJ-E - - • • •
BUFFALO FSX1333D3G-K2G 1�24MB SS - Heat-Sink Package 7-7-7-2� - • • •
Century PC3-1�6�� DDR3-1333 9-9-9 2�48MB DS Micron 8DD22D9JNM - - • • •
Elixir M2Y2G64CB8HA9N-CG 2�48MB DS - Heat-Sink Package 7-7-7-2� - • • •
Elixir M2Y2G64CB8HC9N-CG 2�48MB DS Elixir Heat-Sink Package - - • • •
Kingtiger 2GB DIMM PC3-1�666 2�48MB DS SAMSUNG SEC 9�4 HCH9
K4B1G�846D
- - • • •
(continua na próxima página)
BP5311_P7H55-M BR.indb 5 8/18/1� 9:48:35 AM