Anaren A2530E24A, User Manual

Page: 33 / 46

AIR BoosterPack
– User’s Manual
Page 33 of 45
Release Date 11/2/12

J3
– External Device Interface
0.1” pitch thru-hole footprint which provides a single location for connecting external
devices (e.g. sensors) to the BoosterPack via SPI and/or I
2
C.
It is also possible to connect an external MCU acting as SPI/I
2
C master to this port,
provided the LaunchPad/BoosterPack MCU is removed or configured as SPI/I
2
C slave
device (e.g. to drive LEDs or monitor pushbuttons). Firmware examples for using the
LaunchPad/BoosterPack MCU as a slave device are not provided.
Please note that the shunt must be removed from JP2 when using an external SPI slave
device (see section for more details).
Table 19 – J3 External Device Connector Pinout
Pin Signal Name I/O Description
J3-1 GND - Ground reference
J3-2 P1.4/CUR/MRDY/EXT_CS O Chip Select output to external SPI slave
– active low
J3-3 VDD O Supply voltage to external device(s)
J3-4 P1.7/MOSI
O
MOSI output to external SPI slave
(MCU on LaunchPad or BoosterPack)
I
MOSI input from external SPI master
(external MCU connected via J3)
J3-5 SCL
O
Clock output to external I
2
C slave(s)
(MCU on LaunchPad or BoosterPack)
I
Clock input from external I
2
C master
(external MCU connected via J3)
J3-6 P1.6/MISO/LED2
O
MISO output to external SPI master
(external MCU connected via J3)
I
MISO input from external SPI slave
(MCU on LaunchPad or BoosterPack)
J3-7 SDA I/O I
2
C Data
J3-8 P1.5/SCLK
O
SCLK output to external SPI slave
(MCU on LaunchPad or BoosterPack)
I
SCLK input from external SPI master
(external MCU connected via J3)
J3-9 GND - Ground reference
J3-10 P2.0/MODULE_SS
O
Not Used
(MCU on LaunchPad or BoosterPack)
I
Radio Module Chip Select input from external SPI
master
(external MCU connected via J3)
J3-11 SRDY O Radio Module Slave Ready output
J3-12 MRST
O
Not Used
(MCU on LaunchPad or BoosterPack)
I
Radio Module hardware reset
– active low
(external MCU connected via J3)