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Rev. C

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Page 12 of 48

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December 2006

ADSP-TS201S

PIN FUNCTION DESCRIPTIONS

While most of the ADSP-TS201S processor’s input pins are nor-
mally synchronous—tied to a specific clock—a few are 
asynchronous. For these asynchronous signals, an on-chip syn-
chronization circuit prevents metastability problems. Use the ac 
specification for asynchronous signals when the system design 
requires predictable, cycle-by-cycle behavior for these signals.

The output pins can be three-stated during normal operation. 
The DSP three-states all output pins during reset, allowing these 
pins to get to their internal pull-up or pull-down state. Some 
pins have an internal pull-up or pull-down resistor (±30% toler-
ance) that maintains a known value during transitions between 
different drivers. 

Table 3. Pin Definitions—Clocks and Reset 

Signal

Type

Term

Description

SCLKRAT2–0

I (pd)

na

Core Clock Ratio. The DSP’s core clock (CCLK) rate = n × SCLK, where n is user-
programmable using the SCLKRATx pins to the values shown in 

Table 4

. These pins 

may change only during reset; connect these pins to V

DD_IO

 or V

SS

. All reset specifica-

tions in 

Table 25

Table 26

, and 

Table 27

 must be satisfied. The core clock rate (CCLK) 

is the instruction cycle rate.

SCLK

I

na

System Clock Input. The DSP’s system input clock for cluster bus. The core clock rate 
is user-programmable using the SCLKRATx pins. 

For more information, see Clock 

Domains on Page 9.

RST_IN

I/A

na

Reset. Sets the DSP to a known state and causes program to be in idle state. RST_IN 
must be asserted a specified time according to the type of reset operation.  For details, 
see 

Reset and Booting on Page 9

Table 25 on Page 26

, and 

Figure 13 on Page 26

.

RST_OUT

O

na

Reset Output. Indicates that the DSP reset is complete. Connect to POR_IN.

POR_IN

I/A

na

Power-On Reset for internal DRAM. Connect to RST_OUT.

I

 = input; 

A

 = asynchronous; 

O

 = output; 

OD

 = open-drain output; 

T

 = three-state; 

P

 = power supply; 

G

 = ground; 

pd

 = internal pull-down 

5 k

Ω

pu

 = internal pull-up 5 k

Ω

pd_0

 = internal pull-down 5 k

Ω

 on DSP ID = 0; 

pu_0

 = internal pull-up 5 k

Ω

 on DSP ID = 0; 

pu_od_0

 = internal 

pull-up 500

Ω

 on DSP ID = 0; 

pd_m

 = internal pull-down 5 k

Ω

 on DSP bus master; 

pu_m

 = internal pull-up 5 k

Ω

 on DSP bus master; 

pu_ad

 

= internal pull-up 40 k

Ω

. For more pull-down and pull-up information, see 

Electrical Characteristics on Page 22

.

Term (termination of unused pins) column symbols:

 epd = external pull-down approximately 5 k

Ω

 to V

SS

; epu = external pull-up approx-

imately 5 k

Ω

 to V

DD_IO

, nc = not connected; na = not applicable (always used); V

DD_IO

 = connect directly to V

DD_IO

; V

SS

 = connect directly to V

SS

Table 4. SCLK Ratio 

SCLKRAT2–0

Ratio

000

(default)

4

001

5

010

6

011

7

100

8

101

10

110

12

111

Reserved

Summary of Contents for TigerSHARC ADSP-TS201S

Page 1: ...hip emulation Single precision IEEE 32 bit and extended precision 40 bit floating point data formats and 8 16 32 and 64 bit fixed point data formats KEY BENEFITS Provides high performance static super...

Page 2: ...11 Pin Function Descriptions 12 Strap Pin Function Descriptions 20 ADSP TS201S Specifications 21 Operating Conditions 21 Electrical Characteristics 22 Package Information 23 Absolute Maximum Ratings...

Page 3: ...rupt controller that supports hardware and soft ware interrupts supports level or edge triggers and supports prioritized nested interrupts Four 128 bit internal data buses each connecting to the six 4...

Page 4: ...ns four computational units an ALU a multiplier a 64 bit shifter a 128 bit CLU and a 32 word register file Register File each compute block has a multiported 32 word fully orthogonal register file use...

Page 5: ...either level sensitive or edge sensitive except the IRQ3 0 hardware interrupts which are programmable The DSP distinguishes between hardware interrupts and soft ware exceptions handling them differen...

Page 6: ...er 32 bits of the external data bus connect to even addresses and the upper 32 bits connect to odd addresses The external port supports pipelined slow and SDRAM proto cols Addressing of external memor...

Page 7: ...fairness feature prevents one DSP from holding the external bus too long The DSP s four link ports provide a second path for interproces sor communications with throughput of 4G bytes per second The...

Page 8: ...r different DMA channels and have different transmission attributes Two dimensional transfers The DMA controller can access and transfer two dimensional memory arrays on any DMA transmit or receive ch...

Page 9: ...y can provide the test for conditional branching RESET AND BOOTING The ADSP TS201S processor has three levels of reset Power up reset after power up of the system SCLK all static inputs and strap pins...

Page 10: ...asing productivity Statistical profiling enables the programmer to nonintrusively poll the processor as it is running the program This feature unique to VisualDSP enables the software developer to pas...

Page 11: ...use as a cost effective method to learn more about developing or prototyping applications with Analog Devices processors platforms and software tools Each EZ KIT Lite includes an evaluation board alon...

Page 12: ...e SCLK I na System Clock Input The DSP s system input clock for cluster bus The core clock rate is user programmable using the SCLKRATx pins For more information see Clock Domains on Page 9 RST_IN I A...

Page 13: ...lave devices can deassert ACK to add wait states to external memory accesses ACK is used by I O devices memory controllers and other periph eralsonthedataphase TheDSPcandeassertACKtoaddwaitstatestorea...

Page 14: ...SDCKE LDQM and HDQM pins and the DSP puts the SDRAM in self refresh mode The DSP asserts HBG until the host deasserts HBR In multiprocessor systems the current bus master DSP drives HBG and all slave...

Page 15: ...e IOEN makes the I O device drive the data instead of the TigerSHARC IOEN O T pu_0 nc I O Device Output Enable Enables the output buffers of an external I O device for fly by transactions between the...

Page 16: ...ive when accessing an even address in word accesses or when memory is configured for a 32 bit bus to disable the write of the high word SDA10 O T pu_0 nc SDRAM Address Bit 10 Separate A10 signals enab...

Page 17: ...onnect directly to VDD_IO VSS connect directly to VSS 1 See the reference on Page 11 to the JTAG emulation technical reference EE 68 Table 10 Pin Definitions Flags Interrupts and Timer Signal Type Ter...

Page 18: ...ermination of unused pins column symbols epd external pull down approximately 5 k to VSS epu external pull up approx imately 5 k to VDD_IO nc not connected na not applicable always used VDD_IO connect...

Page 19: ...RST VREF can be connected to a power supply or set by a voltage divider circuit as shown in Figure 6 For more information see Filtering Reference Voltage and Clocks on Page 10 SCLK_VREF I na System Cl...

Page 20: ...h Table 17 shows the resistors that are enabled during active reset and during normal operation Table 16 Pin Definitions I O Strap Pins Signal Type at Reset On Pin Description EBOOT I pd_0 BMS EPROM B...

Page 21: ...K FLAG3 0 DS2 0 ENEDREG 3 Values represent dc case During transitions the inputs may overshoot or undershoot to the voltage shown in Table 18 based on the transient duty cycle The dc case is equivalen...

Page 22: ...put Voltage1 VDD_IO Min IOL 4 mA 0 4 V IIH High Level Input Current VDD_IO Max VIN VIH Max 20 A IIH_PU High Level Input Current VDD_IO Max VIN VIH Max 20 A IIH_PD High Level Input Current VDD_IO Max V...

Page 23: ...Type Z Lead Free Option optional ccc See Ordering Guide LLLLLLLLL L Silicon Lot Number R R Silicon Revision yyww Date Code vvvvvv Assembly Lot Code LLLLLLLLL L 2 0 tppZ ccc T ADSP TS20xS a yyww count...

Page 24: ...tput drive strengths refer to Figure 37 on Page 38 through Figure 44 on Page 39 Rise and Fall Time vs Load Capacitance and Figure 45 on Page 39 Out put Valid vs Load Capacitance and Drive Strength The...

Page 25: ...age 12 2 For more information see Clock Domains on Page 9 3 The value of tSCLK SCLKRAT2 0 must not violate the specification for tCCLK 4 System clock transition times apply to minimum SCLK cycle time...

Page 26: ...Min Max Unit Timing Requirements tRST_IN_PWR RST_IN Deasserted After VDD VDD_A VDD_IO VDD_DRAM SCLK and Static Strap Pins Stable 2 ms tTRST_IN_PWR 1 TRST Asserted During Power Up Reset 100 tSCLK ns S...

Page 27: ...ing Characteristic tRST_OUT RST_OUT Deasserted After RST_IN Deasserted 1 5 ms Figure 14 Normal Reset Timing Table 28 On Chip DRAM Refresh1 Parameter Min Max Unit Timing Requirement tREF On chip DRAM R...

Page 28: ...Low Word SDRAM Data Mask 4 0 1 0 1 15 2 0 SCLK HDQM High Word SDRAM Data Mask 4 0 1 0 1 15 2 0 SCLK SDA10 SDRAM ADDR10 4 0 1 0 1 15 2 0 SCLK HBR Host Bus Request 1 5 0 5 SCLK HBG Host Bus Grant 1 5 0...

Page 29: ...tions applicable during reset only 11 JTAG system pins include RST_IN RST_OUT POR_IN IRQ3 0 DMAR3 0 HBR BOFF MS1 0 MSH SDCKE LDQM HDQM BMS IOWR IORD BM EMU SDA10 IOEN BUSLOCK TMR0E DATA63 0 ADDR31 0 R...

Page 30: ...utput Voltage Low VO_P or VO_N RL 100 0 92 V VOD Output Differential Voltage RL 100 300 650 mV IOS Short Circuit Output Current VO_P or VO_N 0 V 5 55 mA VOD 0 V 10 mA VOCM Common Mode Output Voltage 1...

Page 31: ...CR tCCLK 0 10 tCCLK 1 4 8 0 25 LCR tCCLK 0 15 tCCLK 1 5 6 8 0 25 LCR tCCLK 0 30 tCCLK 1 7 8 ns ns ns tLACKID Delay from LxACKI rising edge to first transmission clock edge Figure 21 16 LCR tCCLK 1 2 n...

Page 32: ...CLKOL tLCLKOH tLCLKOP VOD MIN VOD MIN VOD 0V tREO tFEO VO_N VO_P RL CL CL_P CL_N RL 100 CL 0 1pF CL_P 5pF CL_N 5pF Figure 20 Link Ports Data Output Setup and Hold1 1 These parameters are valid for bot...

Page 33: ...n End and Stops Figure 23 Link Ports Back to Back Transmission LxCLKOUT LxDATO VOD 0V VOD 0V FIRST EDGE OF 5TH SHORT WORD IN A QUAD WORD tLACKIS tBCMPOH LxACKI LxBCMPO tLACKIH LAST EDGE IN A QUAD WORD...

Page 34: ...s tLDIS LxDATI Input Setup Figure 25 0 201 2 0 251 3 0 301 4 0 351 5 ns ns ns ns tLDIH LxDATI Input Hold Figure 25 0 201 2 0 251 3 0 301 4 0 351 5 ns ns ns ns tBCMPIS LxBCMPI Setup Figure 24 2 tLCLKIP...

Page 35: ...SP TS201S Rev C Page 35 of 48 December 2006 Figure 25 Link Ports Data Input Setup and Hold1 1 These parameters are valid for both clock edges LxCLKIN LxDATI VOD 0V VOD 0V tLDIS tLDIH tLDIS tLDIH tLCLK...

Page 36: ..._IO 2 5V 25 C VDD_IO 2 63V 40 C OUTPUT PIN VOLTAGE V 0 2 8 0 4 0 8 1 2 1 6 2 0 2 4 OUTPUT PIN CURRENT mA 5 0 5 VDD_IO 2 38V 105 C 10 15 20 25 10 15 20 25 30 STRENGTH 1 VDD_IO 2 5V 25 C VDD_IO 2 63V 40...

Page 37: ...rents at Strength 6 Figure 33 Typical Drive Currents at Strength 7 OUTPUT PIN VOLTAGE V 0 2 8 0 4 0 8 1 2 1 6 2 0 2 4 OUTPUT PIN CURRENT mA 11 0 11 VDD_IO 2 38V 105 C 22 33 44 66 22 33 44 66 88 STRENG...

Page 38: ...does not apply to output disable delays see Output Disable Time on Page 37 The graphs of Figure 37 through Figure 45 may not be linear outside the ranges shown Figure 36 Equivalent Device Loading for...

Page 39: ...ANCE pF 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 RISE TIME Y 0 0377x 0 7449 FALL TIME Y 0 0374x 0 851 STRENGTH 6 VDD_IO 2 5V Figure 44 Typical Output Rise and Fall Time 10 to 90 VDD_IO 2 5 V v...

Page 40: ...ir flow source may be required Table 34 shows the thermal characteristics of the 25 mm 25 mm BGA_ED package All parameters are based on a JESD51 9 four layer 2s2p board All data are based on 3 W power...

Page 41: ...l assignments Figure 46 576 Ball BGA_ED Pin Configurations1 Top View Summary 1 For a more detailed pin summary diagram see the EE 179 ADSP TS201S System Design Guidelines on the Analog Devices website...

Page 42: ...ADDR26 D19 ADDR27 A20 ADDR28 B20 ADDR29 C20 ADDR24 D20 ADDR25 A21 ADDR22 B21 ADDR23 C21 ADDR20 D21 VSS A22 VSS B22 VSS C22 VSS D22 ADDR19 A23 ADDR21 B23 VSS C23 VDD_IO D23 ADDR17 A24 VSS B24 ADDR18 C...

Page 43: ..._P K24 L0CLKINP L24 L0DATI2_P M24 L0DATO3_P N1 ID0 P1 SCLK R1 VSS T1 RST_IN N2 VSS P2 SCLK_VREF R2 NC SCLK 1 T2 SCLKRAT2 N3 VDD_A P3 VSS R3 NC SCLK_VREF 1 T3 BR4 N4 VDD_A P4 BM R4 BR7 T4 DS0 N5 VDD_IO...

Page 44: ...DMAR2 AD6 DMAR3 AA7 DMAR0 AB7 DMAR1 AC7 CPA AD7 DPA AA8 HBR AB8 HBG AC8 BOFF AD8 BUSLOCK AA9 L3BCMPO AB9 L3ACKI AC9 L3DATO0_N AD9 L3DATO0_P AA10 L3DATO1_N AB10 L3DATO1_P AC10 L3CLKON AD10 L3CLKOP AA1...

Page 45: ...N MILLIMETERS 2 THE ACTUAL POSITION OF THE BALL GRID IS WITHIN 0 25 mm OF ITS IDEAL POSITION RELATIVE TO THE PACKAGE EDGES 3 CENTER DIMENSIONS ARE NOMINAL 4 THIS PACKAGE CONFORMS TO JEDEC MS 034 SPECI...

Page 46: ...P 576 576 Ball BGA_ED ADSP TS201SABP 050 40 C to 85 C 500 MHz 24M bit 1 05 VDD 2 5 VDD_IO 1 5 VDD_DRAM BP 576 576 Ball BGA_ED ADSP TS201SYBP 050 40 C to 105 C 500 MHz 24M bit 1 05 VDD 2 5 VDD_IO 1 5 V...

Page 47: ...ADSP TS201S Rev C Page 47 of 48 December 2006...

Page 48: ...Rev C Page 48 of 48 December 2006 ADSP TS201S 2006 Analog Devices Inc All rights reserved Trademarks and registered trademarks are the property of their respective owners D04324 0 11 06 C...

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