11
DEMO MANUAL
Rev. 0
POWER CONNECTIONS BETWEEN ASSEMBLIES
AND OPTIONAL HEATSINKS
Heatsinks as shown in Figure 12 can be added to each
master and slave DC2331A assembly power section.
When used with a fan, the heatsinks will decrease
the thermal resistance between the DC2331A power
components and the ambient environment to increase
output power capability or lower component tempera-
tures. The DC2331A PCB design provides holes for
heatsink mounting.
Figure 12. Heatsinks Can Be Added to DC2331A Assemblies for Improved Thermal Performance
