UG-1896
EVAL-ADAQ23875FMCZ
User Guide
Rev. 0 | Page 16 of 26
Good quality ceramic bypass capacitors of at least 2.2 µF (0402,
X5R) must be placed from the output of the LDOs generating
the μModule supply rails (VDD, VIO, VS+, and VS−) to GND
to minimize electromagnetic interference (EMI) susceptibility
and to reduce the effect of glitches on the power supply lines.
All the other required bypass capacitors are laid out within the
ADAQ23875
, saving extra board space and cost. When the
external decoupling capacitors on the REFIN, VDD, and VIO pins
near the µModule are removed, there is no significant
performance impact.
MECHANICAL STRESS
The mechanical stress of mounting a device to a board may
cause subtle changes to the SNR and internal voltage reference.
The best soldering method is to use IR reflow or convection
soldering with a controlled temperature profile. Hand soldering
with a heat gun or a soldering iron is not recommended.
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