ADXL180
Rev. 0 | Page 7 of 56
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage (V
BP
− V
BN
)
−0.3 V to +21 V
Voltage at Any Pin with
Respect to V
BN
Except V
BP
−0.3 V to V
DD
+ 0.3 V
Storage Temperature Range
−55°C to +150°C
Soldering Temperature
255°C
Operating Temperature Range
−40°C to +125°C
ESD All Pins
1.5 kV HBM
Latch-Up Current
100 mA
Mechanical Shock
Unpowered ±4000
g
(0.5 ms, half sine)
Powered
±2000
g
(0.5 ms, half sine);
−0.3 V to +7.0 V
Drop Test (onto Concrete)
m
Thermal Gradient
±20°C/minute
1
Soldered to FR4 coupon printed circuit board (PCB) at the dimensions of
25.4 mm × 25 mm. During test, the PCB is fastened to a support with 46
g
mass, equivalent to a typical satellite module PCB.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
RAMP-DOWN
RAMP-UP
CRITICAL ZONE
t
L
TO
t
P
T
EM
PER
A
T
U
R
E
T
A
= 25°C
t
L
t
P
TIME
t = 25°C TO PEAK
t
S
PREHEAT
t
L
t
P
T
SMIN
T
SMAX
07
54
4-
0
04
Figure 2. ADXL180 Pb-Free Solder Profile
Table 3. ADXL Solder Profile Parameters
Profile Feature
Small Body Pb-Free Assemblies
Average Ramp-Up Rate (T
L
to T
P
) 3°C/second
maximum
Preheat Temperature Min (T
S
min) to Temperature Max (T
S
max)
150°C to 200°C
Time (min to max) (t
S
)
60 sec to 180 sec
T
S
max to T
L
Ramp-Up Rate
3°C/second maximum
Time Maintained Above Temperature (T
L
)
217°C
Time (t
L
)
60 sec to 150 sec
Peak Temperature (T
P
) 260°C
+5/−5°C
Time Within 5°C of Actual Peak Temperature (t
P
)
20 sec to 40 sec
Ramp-Down Rate
6°C/sec maximum
Time 25°C to Peak Temperature
8 minutes maximum
