AD5100
Rev. A | Page 8 of 36
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
V
1MON
to GND
−0.3 V, +33 V
V
2MON
to GND
−0.3 V, +33 V
V
3MON
to GND
−0.3 V, +7 V
V
4MON
to GND
−0.3 V, +33 V
V
OTP
to GND
−0.3 V, +7 V
Digital Input Voltage to GND
(MR, WDI, SCL, SDA, AD0)
0 V, +7 V
Digital Output Voltage to GND
(RESET, V
4OUT
, SHDNWARN)
0 V, +7 V
Digital Output Voltage to GND (SHDN)
0 V, +33 V
Operating Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
ESD Rating (HBM)
3.5 kV
Maximum Junction Temperature (T
Jmax
)
150°C
Power Dissipation
(T
Jmax
− T
A
)/θ
JA
Thermal Impedance
θ
JA
Junction-to-Ambient
105.44°C/W
θ
JC
Junction-to-Case
38.8°C/W
IR Reflow Soldering (RoHS-Compliant Package)
Peak Temperature
260°C (+0°C)
Time at Peak Temperature
20 sec to 40 sec
Ramp-Up Rate
3°C/sec max
Ramp-Down Rate
−6°C/sec max
Time from 25°C to Peak Temperature
8 minutes max
1
Values relate to the package being used on a 4-layer board.
2
T
A
= ambient temperature.
3
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a
heat sink. Junction-to-ambient resistance is more useful for air-cooled
PCB-mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
