2–48
Chapter 2: Board Components
On-Board Memory
Cyclone III 3C120 Development Board Reference Manual
© March 2009 Altera Corporation
The board provides both 12 V and 3.3 V to installed daughter cards up to 18.6 W each.
Table 2–49
shows the maximum current allowed per voltage.
Table 2–50
lists HSMC component reference and manufacturing information.
On-Board Memory
This section describes the on-board memory interface support, provides signal name,
type, and signal connectivity relative to the Cyclone III device.
The board has the following on-board memory:
■
DDR2 SDRAM
■
SRAM
DDR2 SDRAM
The board has 256 MB of dual-channel DDR2 SDRAM memory with a 72-bit data
width. These devices use the 1.8-V SSTL signaling standard.
The data bus can be configured as two separate buses of 32 bits each, or a single 32-bit
and a single 40-bit bus. One address/control bus is referred to as TOP and the other is
referred to as BOT (bottom), as they connect to the respective Cyclone III device
edges. The interface comprises four ×16 devices for the 64-bit datapath, and a single
×8 device for the ECC bits for a total of 5 devices (3 to TOP, 2 to BOT). The Micron part
numbers are MT47H32M16CC-3 for the ×16 devices and MT47H32M8BP-3 for the ×8
device.
N/A
User LED intended to show RX data
activity on the HSMC interface
2.5 V
HSMB_RX_LED
F26
N/A
User LED intended to show TX data
activity on the HSMC interface
2.5 V
HSMB_TX_LED
D28
Table 2–48.
HSMC Port B Interface Signal Name, Description, and Type (Part 4 of 4)
Board
Reference
Description
I/O Standard
Schematic
Signal Name
Cyclone III
Device Pin
Number
Table 2–49.
HSMC Power Supply
Voltage
Maximum Current
From Host
Maximum Wattage
12 V
1.0 A
12.0 W
3.3 V
2.0 A
6.6 W
Table 2–50.
HSMC Component Reference and Manufacturing Information
Board
Reference
Description
Manufacturer
Manufacturing
Part Number
Manufacturer
Website
J8 and J9
High-speed mezzanine card (HSMC), custom
version of QSH-DP family high speed socket
Samtec
ASP-122953-01
www.samtec.com
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