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Agilent E2259A Specifications
45
Appendix A
Agilent E2259A Specifications
The Agilent E2259A Double-Wide Breadboard Module complies with the
Mezzanine Concept M-Module Specification.
The specifications of Agilent E2259A are listed in the following table:
ITEM
SPECIFICATIONS
User Component Area
70 cm
2
(10.86 in
2
) occupying two slots.
Grid Hole Spacing
2.54 mm (0.1 in.)
Grid Hole Inside Diameter
1.17 mm (0.046 in.)
Maximum Component Height
5.3 mm (0.21 in.) above board in Region A,
10.5 mm (0.42 in.) above board in Region B.
Refer to “Agilent E2259A Connectors Layout” on page 13.
Maximum Lead Length
1.2 mm (0.078 in.) below board.
Refer to “Agilent E2259A Connectors Layout” on page 13.
Maximum Power Dissipation
(per module)
Determined by mainframe cooling and/or Agilent E2251A Cooling Capacity.
Do not exceed 40 Watts.
Power Supplies
+5 VDC ±5% @ 100mA maximum
+12 VDC ±5% @ 200mA maximum
-12VDC ±5% @ 200mA maximum
Connectors
Two 44-pin connectors (user interface),
Two 40-pin connectors to the carrier
Summary of Contents for E2259A
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Page 5: ...2 Contents Appendix A Agilent E2259A Specifications 45 ...
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Page 37: ...34 Register Descriptions or decimal 2 097 408 16 2 097 424 ...