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Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723
E-mail: [email protected] | Web: www.advanced.com
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Specs. subject to change without notice. Dim. shown: inch/(mm) Loctite and CHIPBONDER are registered trademarks of Henkel AG & Co. KGaA Item FT-INS-003 (Rev 5/10)
Installation
STEP 1
Place the Flip-Top™ BGA Socket lower
assembly onto PC board using the chamfer
as A1 pin location (see Fig. 1).
For SMT Plus (terminal mounting types -862
& -863) and SMT/Screw Mount models
(terminal mounting types -864 & -865) ,
reflow lower assembly to PC board.
For SMT
Standard model (terminal mounting types
-860 & -861), see note below prior to reflow.
SMT Standard Option Note:
Before reflow:
apply an epoxy (i.e.Loctite
®
CHIPBONDER
®
348
™
) on the lower
assembly as shown before placement on
PCB and prior to soldering. Gently
depress wafer stack manually, onto PCB
footprint. [See Fig. 1a]
SMT/Screw Mount Option Note:
After reflow:
fasten socket through
opposite side of PCB (use .067" dia.
clearance holes) with #0-80 screws and
washers provided, into tapped holes as
shown. Tighten to 1.20 lb-in with a .050"
(CF) hex drive; do not over tighten.
[See Fig. 1b]
See Application Specification (available
online) or part number specific CAD drawing
for board layout recommendations.
STEP 2
Align the Flip-Top BGA Socket upper
assembly and lower assembly using the
chamfer as a guide (see Fig. 2). Guide posts
on upper assembly should be inserted into
holes on lower assembly.
Light pressure is required to “seat” the
upper assembly to the lower assembly (see
Fig. 2a).
Fig.1
Fig.2
Fig.2a
Mod5 Series 0.50mm Pitch
Flip-Top
™
BGA Socket
Components
INSTALLATION &
GENERAL USAGE
INSTRUCTIONS
1. #0-80 screws (four supplied)
2. Chip support plate
3. Turn-screw heat sink
4. BGA device (not supplied)
5. Upper assembly
6. Lower assembly
Fig.1b
(Bottom view of
lower assembly)
Fig.1a
(Bottom view of
lower assembly)
.06 [1.6] DIA.
EPOXY DROPLET;
4 PLACES
APPROX.
AS SHOWN
PCB
SCREW MOUNT
HOLES, 4 PLACES
