Chapter 2
Product Overview
16
Reference Manual
nanoX-TCR
Thermal/Cooling Requirements
The nanoX-TCR is designed to operate at its maximum CPU speeds of 600MHz, 1.3GHz, and 1.6GHz and
requires a thermal solution to cool the CPU, PCH, and voltage regulators. ADLINK offers one optional
cooling solution as well as a heat spreader platform on which to build a cooling solution. (See
for
descriptions of cooling options.)
Figure 2-7. Stack Heights of Cooling Assemblies (Side Width Views)
NOTE
The overall system design must keep the ICs within their operating temperature
specifications.
Table 2-7. ADLINK Optional Cooling Solutions
Cooling Solution
Description
Passive Heat Sink
(without fan)
Qualified to maintain optimal performance up to +70°C.
Heat Spreader
Provides a simple thermal platform on which to build a cooling solution.
NOTE
All heights are given in inches.
Heatsink
Heat Spreader
0.43 (11.00mm)
0.22 (5.60mm)
0.59 (15.00mm)
0.22 (5.60mm)
nanoX-TCR_Cooling_Ht_a
