17
3 Functional Description
3.1 CPU, Memory and Chipset
3.1.1 CPU
The Intel® Xeon® processor E3 1275V2/E3 1225V2/Core i3 implements several key
technologies:
Two channels of DDR3 Unbuffered Dual In-Line Memory Modules (UDIMM) with a
maximum of two DIMMs per channel
Integrated I/O with up to 16 lanes for PCI Express Generation 3.0
8 /3MB of shared cache
Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3) and
Streaming SIMD Extensions 4 (SSE4)
The Intel® Xeon® processor E3-1275V2 /E3-1225V2/ Core i3 supports several advanced
technologies:
Execute Disable Bit
Intel® 64 Technology
Enhanced Intel® SpeedStep® Technology
Intel® Virtualization Technology (Intel® VT)
Intel® Hyper-Threading Technology (Intel® HT Technology)
The Intel® Xeon® processor E3 1275V2/ E3 1225V2 /Core i3 3220 has a maximum TDP of
77W/55W and has an elevated case temperature specification. The elevated case
temperatures are intended to meet the short-term thermal profile requirements of NEBS Level
3. The Intel® Xeon® processor is ideal for thermally constrained form factors in embedded
servers, communications and storage markets.
Supported Processors, Maximum Power Dissipation
The following table describes the Intel® Xeon® processor E5 family CPUs supported by the
aTCA-9300:
Name
E3 1275V2
E3 1225V2
Core i3
cache 8M
8M 8MB
Clock 3.5GHz 3.2 3.3GHz
QPI
8.0 GT/s
8.0 GT/s
N/A
TDP
77W
77W
55W
