AcroPack Series APCe7010E-LF
PCI Express Carrier Board
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6.
SPECIFICATIONS
PHYSICAL
Physical Configuration
Length (APCe7010E-LF) 5.159 inches (131.04 mm)
Height 2.711 inches (68.86 mm)
Board thickness 0.062” +/-0.006” (1.575 mm)
Max component height 0.402 inches (10.21 mm)
Max component height under AcroPack modules
0. 0789 inches (2.00 mm)
Weight 2.777 oz. (78.716 g)
Connectors
P1 (PCIe Bus) PCI Express V2.1 one lane
J2 (Carrier Field I/O) 50-pin Champ (TE Connectivity 6658751-1)
P2 (AcroPack Field I/O) 100-pin socket (Samtec SS5-50-3.00-L-D-K-TR)
J1 (Mini-PCIe) 52-pin socket (TE Connectivity 1759457-1)
P3 (JTAG) 14-pin header (Molex 87832-1420)
Isolation
This AcroPack carrier is designed to provide isolation between the AcroPack
Field I/O signals and the host. The AcroPack module must also be an isolated
AcroPack module to maintain the isolation between the logic and field I/O
signals. Unless isolation is provided on the AcroPack module itself, the field
I/O connections are not isolated from the PCIe bus.
Host logic and field I/O are isolated from each other for voltages up to
250VAC or DC on a continuous basis (unit will withstand a 1500V AC dielectric
strength test for one minute without breakdown). The carrier is designed to
be used with isolated AcroPack modules.
Due to the spacing between the pads of the 50-pin Champ connector and
cable, the isolation between adjacent pins/signals on the front I/O is 30 V.
Isolated Power
The use of an optional isolated DC/DC Converter is required for use with
isolated Acromag AcroPack modules. See section 2 and Figure 1 for the
carrier board location of the isolated DC/DC converter.