A
CHI
®
16
Prompt
1
Installed the equipment in stable work platform to use where the air mobility should be small as
possible .Avoid it closing to air conditioners, fans and the other outlet.
2
A
CHI
®
IR-PRO-SC
Rework Station sensor Direct contact with motherboard
So Temperature
display is Actual temperature
3
In order to avoid damage to the motherboard capacitor
so use insulation tape please
Maintenance completed ,then Removal of insulation tape
So as to avoid short-circuit
4
After removal of BGA chip
PCB Bonding Pad Need to clean up
Avoid cold solder joint See
BGA chip tin completely liquefied, Then To move the BGA chip
So as to avoid Bonding Pad
Damage
5
BGA chips should be subject to settlement, floating state Prohibited in all solder ball did not fully
liquefied, by force if removal of chips, so as to avoid pad off, chip or motherboard scrap!
6
To improve success rate of Rework , PCB and chips need drying and processing in principle
PCB board or chip moist heat process will occur in the burst phenomenon, the Rework process
may hear the blasting sound of a minor
According to actual situation Please
self-control.
7
PCB board heating time is too long or repeated several times the surface heating will lead to
discoloration.
8
Users from modifying temperature parameters
Please use scrap PCB tested
Heating whole
time about 10 seconds before the end of solder balls should be fully liquefied
f the liquefaction
advanced or delayed,
Should be regulating up/down the temperature setting. So as to avoid heat
damage to chips or low-temperature sealing-off
9
The factory equipped with two sets of programmable temperature control table used parameters:
PTN-1
Lead Rework
PTN-2
Lead-Free Rework
Rework temperature curve to set examples
Lead : Sn63Pb37
PTN- 1
r1
1
L1
85
d1
80
r2
1
L2
150
d2
55
r3
1
L3
185
d3
45
r4
END
Lead-Free:
Sn96.5Ag3Cu0.5
PTN- 2
r1
1
L1
85
d1
60
r2
1
L2
140
d2
45
r3
1
L3
170
d3
35
r4
1
L4
220
d4
40
r5
END
