UM027 FC6301 User Manual
r1.3
UM027
www.4dsp.com
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5
Environment
5.1 Temperature
Operating temperature
0
°
C to +60
°
C (Commercial)
-40
°
C to +85
°
C (Industrial)
Storage temperature:
-40
°
C to +120
°
C
5.2 Convection cooling
The air flow provided by the chassis fans the FC6301 is enclosed in will dissipate the heat
generated by the on board components. A minimum airflow of 300 LFM is recommended.
Optionally a low profile heat sink/fan can be glued on top of the Quad ADC. The card has a
fan power connection that can be switch on and off under carrier card control (TBD).
For standalone operations (such as on a Xilinx development kit), it is highly recommended to
blow air across the FMC and ensure that the temperature of the devices is within the allowed
range. 4DSP’s warranty does not cover boards on which the maximum allowed temperature
has been exceeded.
6
Safety
This module presents no hazard to the user.
7
EMC
This module is designed to operate from within an enclosed host system, which is build to
provide EMC shielding. Operation within the EU EMC guidelines is not guaranteed unless it
is installed within an adequate host system. This module is protected from damage by fast
voltage transients originating from outside the host system which may be introduced through
the system.
8
Warranty
Hardware
Software/Firmware
Basic Warranty
(included)
1 Year from Date of Shipment
90 Days from Date of Shipment
Extended Warranty
(optional)
2 Years from Date of Shipment
1 Year from Date of Shipment
