RX-Z9/DSP-Z9
RX-Z9/DSP-Z9
3
▼
RX-Z9
■
FRONT PANELS
▼
DSP-Z9
Caution:
1. As the melting point temperature of the lead free solder is
about 30
°
C to 40
°
C (50
°
F to 70
°
F) higher than that of the
lead solder, be sure to use a soldering iron suitable to
each solder.
2. If lead solder must be used, be sure to remove lead-free
solder from each terminal section of the parts to be re-
placed and from the area around it completely before sol-
dering, or make sure that the lead free solder and lead
solder melt together fully.
注意:
1. 無鉛ハンダの融点温度は通常の鉛入りハンダに比べ30〜
40 ℃程度高くなっていますので、それぞれのハンダに
合ったハンダごてをご使用ください。
2. 鉛入りハンダを使わざるを得ない場合は、あらかじめ交
換する部品端子部やその周辺部の無鉛ハンダをすべて取
り除くか、あるいは無鉛ハンダと鉛入りハンダが十分に
溶けた状態となるようにハンダ付けしてください。
Содержание RX-Z9
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