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USB Audio 2.0 Reference Design, XS1-L2 Edition Hardware Manual (1.6) 18/32
15
Printed Circuit Board
The PCB is a 1.6mm four layer design in a XMOS XS1-G Development Kit form factor
with dimensions of 180 x 120mm. It is made from FR4 (
ε
r = 4.5) material and
finished in immersion gold. The mounting holes are 3.2mm in diameter.
Signal stack up is as follows:
•
Top signal
•
Ground plane
•
Power plane
•
Bottom signal
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