USB Audio Design Guide
5.2
Project Structure
5.2.1
Applications and Modules
The code is split into several module directories. The code for these modules
can be included by adding the module name to the
USED_MODULES
define in an
application Makefile:
module_xud
Low level USB device library
module_usb_shared
Common code for USB applications
module_usb_device
Common code for USB device applications
module_usb_audio
Common code for USB audio applications
module_spdif_tx
S/PDIF transmit code
module_spdif_rx
S/PDIF receive code
module_adat_rx
ADAT receive code
module_usb_midi
MIDI I/O code
module_dfu
Device Firmware Upgrade code
Figure 29:
Modules used
by USB Audio
There are multiple application directories that contain Makefiles that build into
executables:
app_usb_aud_l1
USB Audio 2.0 Reference Design application
app_usb_aud_l2
USB Audio 2.0 Multichannel Reference Design application
app_usb_aud_skc_u16
U16 SliceKit with Audio Slice application
app_usb_aud_xk_u8_2c
Multi-function Audio board application
app_usb_aud_skc_su1
DJ kit application
Figure 30:
USB Audio
Reference
Applications
5.3
Build Configurations
Due to the flexibility of the framework there are many different build options. For
example input and output channel count, Audio Class version, interface types etc.
A “build configuration” is a set of build options that combine to produce a certain
feature set.
Build configurations are listed in the application makefile with their associated
options, they can be built within the xTIMEComposer GUI or via the command like
as follows:
x m a k e C O N F I G = < c o n f i g name >
When a reference design application is compiled using “build all” (
xmake all
on
command line) all configurations are automatically built.
A naming scheme is employed in each application to link a feature set to a build
configuration/binary. Different variations of the same basic scheme are used. This
scheme is described in the next section.
XM0088546.1
Содержание xCORE-200 Multi-channel Audio board
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