ECO NO:
DATE:
APPROVED:
REVISION RECORD
LTR
A
D
C
6
A
B
C
D
5
4
3
2
1
B
SCALE:
SHEET: OF
DRAWING NO:
TITLE:
COMPANY:
RELEASED:
DATED:
DATED:
QUALITY CONTROL:
CHECKED:
DATED:
DATED:
DRAWN:
CODE:
SIZE:
REV:
23
18
<Scale>
<Revision>
<Drawing Number>
A0
<Code>
<Title>
<Company Name>
<Release Date>
<QC Date>
<Checked Date>
<Drawn Date>
<Released By>
<QC By>
<Checked By>
<Drawn By>
default
Iphone,L-R-GND-MIC
nokia,L-R-MIC-GND
Earphone Audio
GND of C6018(10uF) and
headset should tie
together and single via to
GND plane
Close to CON6001
Close to BB
Close to MIC
tie together and single via to
GND plane
Earphone MICPHONE
close to IC
close to connector
together then single via to main GND
Close to BB
Close to MIC
Secondary MIC
Single via to
GND plane
Main microphone
Analog MIC
Close to BB
REC
Note: 60-1
Part # of BEAD6002, BEAD6003, BEAD6004 and BEAD6005
needs changed to "BLM18BD102SN1" for high THD
performance (-90dB) but this BOM change will results in FM
RSSI 10dB degraded .
Note 60-1:
Schematic design notice of "60_PERI_AUDIO_IO" page.
To reserve a resistor in HPL and HPR in series connection both in order to
optimize headphone pop noise. The recommended value of this resistor is 33R.
Note 60-2:
Note: 60-2
C836£ºwhen use AW8145 please use 1uF CAP;when use AW8155 or AW8155A please use 0 ohm res
SPEAKER
SPEAKER OPTION2
Route as differential pair
Route the GND between L/R chanel
Note: 60-3
Note 60-3:
TO Reduce cross talk, Please route the Earhpone_GND between L/R chanel
Note: 60-4
Note 60-3:
To eliminate Plug in and out Recognize issue C6049 should be 100nF
CE ÈÏ֤ʱ,Èç¹ûÓöµ½¹¤Æµ¸ÉÈÅÍƼö0B4015R-423G-XD9RAC-BD-0MIC
[6]
[6]
[16]
[16]
[5]
[6]
[6]
[6]
[6]
[6]
[6]
[22]
[22]
[6]
[18]
[18]
[7]
[7]
[6]
[6]
[6]
[2,3,5,6,7,9,10,11,14,15,16,19,20,21,23]
[6]
[6]
[6,7,8,9,15,19,20,21,22]
[5]
[22]
[22]
[6]
[6]
U2001
J1809
U2001
AU_LORP_EXPA
AU_LORN_EXPA
SPKR_OUT_P
SPKR_OUT_M
VSYS
Содержание Redmi note3
Страница 17: ......
