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1.0

REV

2014-11-10

DATE

SSt

BY

PSL

CHECKED

Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
[email protected]

DESCRIPTION

WCAP-CSGP Ceramic Capacitors

Order.- No.

885012205002

SIZE

A4

Size: 0402

H1: Classification Reflow Profile for SMT components:

H2: Classification Reflow Profiles

Profile Feature

Preheat
 - Temperature Min (Tsmin)

 - Temperature Max (Tsmax)

 - Time (ts) from (Tsmin to Tsmax)

Ramp-up rate (TL to TP)

Liquidous temperature (TL)

Time (tL) maintained above TL

Peak package body temperature (Tp)

Time within 5°C of actual peak temperature (tp)

Ramp-down rate (TP to TL)

Time 25°C to peak temperature

Pb-Free Assembly

150°C
200°C
60-120 seconds

3°C/ second max.

217°C
60-150 seconds

See Table H3

20-30 seconds

6°C/ second max.

8 minutes max.

refer to IPC/JEDEC J-STD-020D

H3: Package Classification Reflow Temperature

PB-Free Assembly

PB-Free Assembly

PB-Free Assembly

Package Thickness

< 1.6 mm

1.6 - 2.5 mm

≥ 2.5 mm

Volume mm³
<350

260°C

260°C

250°C

Volume mm³
350 - 2000

260°C

250°C

245°C

Volume mm³
>2000

260°C

245°C

245°C

refer to IPC/JEDEC J-STD-020D

H Soldering Specifications:

This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before
the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.

Содержание WCAP-CSGP

Страница 1: ...harge Current 50mA 25 C 30 70 RH if not specified differently separate documentation This electronic component has been designed and developed for usage in general electronic equipment only This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe person...

Страница 2: ...s not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death unless the parties have executed an agreement specifically governing such use Moreover Würth Elektronik eiSos GmbH Co KG products are neither designed nor intended for use in areas such...

Страница 3: ...0 260 C 260 C 250 C Volume mm 350 2000 260 C 250 C 245 C Volume mm 2000 260 C 245 C 245 C refer to IPC JEDEC J STD 020D H Soldering Specifications This electronic component has been designed and developed for usage in general electronic equipment only This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failur...

Страница 4: ...r carefully possible specific changes of electrical characteristics like capacitance over temperature voltage and time as well as the specific performance over frequency for the actual use conditions For detailed information see datasheet 2 4 Design of the P C board The chip capacitor shall be located to minimize any possible mechanical stress from deflection or board wrap It is recommended to pos...

Страница 5: ... any contaminated flux as well as excessively high ultrasonic cleaning 2 9 Coating molding and potting of the P C board When coating and molding the P C board verify the quality influence on the capacitor Verify the curing temperature and assure that there is no harmful decomposing or reaction gas emission during curing Do not exceed the maximal temperature rise of 20 C If the product is potted in...

Страница 6: ...n case of further queries regarding the PCN the field sales engineer or the internal sales person in charge should be contacted The basic responsibility of the customer as per Secti on 1 and 2 remains unaffected 6 Product Life Cycle Due to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products As a stan dard reporting procedure of ...

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