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6.5 PCB Pad Design
We recommend a non-solder mask with defined (NSMD) type for the solder pads of
the PCB on which IMA2 modules will be mounted. This type of design enables high
soldering reliability during the SMT process.
We recommend not placing via or micro-via that is not covered by solder resistance
within 0.3 mm around the pads unless it carries the same signal of the pad itself.
Refer to the following figure.
Only blind holes are allowed in the pad. Through holes are not allowed.