PPC3-12-413/Best Practices
v1.0
www.winsystems.com
Page 13
Gauge Wire
Use the largest gauge wire that you can. Most connector manufacturers
have a maximum gauge wire they recommend for their pins.
Contact Points
WINSYSTEMS boards mostly use connectors with gold finish contacts.
Gold finish contacts are used exclusively on high-speed connections.
Power and lower speed peripheral connectors may use a tin finish as an
alternative contact surface. It is critical that the contact material in the
mating connectors is matched properly (gold to gold and tin to tin).
Contact areas made with dissimilar metals can cause oxidation/corrosion,
resulting in unreliable connections.
Pin Contacts
Often the pin contacts used in cabling are not given enough attention. The
ideal choice for a pin contact would include a design similar to Molex or
Trifurcon designs, which provide three distinct points to maximize the
contact area and improve connection integrity in high shock and vibration
applications.
Power Down
Make sure that power has been removed from the system before making
or breaking any connections.
I/O Connections OFF
—Turn off all I/O connections before connecting
them to the embedded computer modules or any I/O cards. Connecting
hot signals can cause damage whether the system is powered or not.
Mounting and Protecting the PPC3-12-413
To avoid damage, mount the PPC3-12-413 properly. Standoff kits are
available and recommended for use with the PPC3-12-413.
Placing the PPC3-12-413 on mounting standoffs
—Be careful when
placing the PPC3-12-413 on the mounting standoffs. Sliding the board
around until the standoffs are visible from the top can cause component
damage on the bottom of the board.
Do not bend or flex the EBC-C413
—Bending or flexing can cause
irreparable damage. Embedded computer modules are especially
Power Supply OFF
—Always turn off the power supply before
connecting to the I/O module. Do not hot-plug the PPC3-12-413 on a
host platform that is already powered.
