WIN Enterprises PL-60590, Руководство пользователя

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User’s Manual
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3-0 Cooling Considerations
3-1 Proper Cooling
The PL-60590 is designed to operate fanlessly and without moving parts whilst still allowing
safe cooling for the internal components, however, the following
considerations and requirements must be observed to ensure warranty viability and safe
operation.
It is up to the integrator to house this devices in it’s proper location.
The processor of the PL-60590 is thermally connected to the top cover, and thus the
surrounding “skin” of the chassis. Once the CPU reaches its optimum operating peaks in
terms of performance, the thermals of the chassis will rise accordingly.
It is recommended that you monitor the thermal properties of the chassis as the skin may
rise to an uncomfortably hot temperature, depending on CPU type, and usage, the external
area of the chassis can reach up to ~55C! (131F) and be quite painful to the touch. The
following rules for safe operation should be considered:
• EXTERNAL TEMPERATURE MONITORING
Monitoring the surface (“skin”) temperature of the unit, at least before handling, is
recommended, though not required.
• INTERNAL TEMPERATURE MONITORING
Due to the fanless nature of this device, components can reach very high
temperatures easily. The BIOS is set to monitor CPU and ambient system
temperatures. These should stay below 80C for maximum CPU life.
Monitoring system temperatures is good practice for any industrial or business PC.
The nature of the PL-6059A/B’s operation is such that component temperature
monitoring is HIGHLY recommended.
Most off-the-shelf temperature monitoring software should work with this device.
WIN does not provide this software.
• CPU COOLING:
The platform is designed to operate with Intel Mobile CPUs, including certain Intel® Celeron
M and Core 2 Processors.
When using a processor with a TDP in excess of 25W it is recommended that you allow