WIN Enterprises MB-80670, Руководство пользователя

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WIN Enterprises, Inc. PL-80670 User Manual 9
1.2 SBC Specifications
System
From Factor 3.5" SBC
CPU Intel Broadwell U SOC
Chipset
Integrated
Memory
1 x DDR3L SO-DIMM / 1600 MHz up to 8GB, w/o ECC support
BIOS
AMI SPI BIOS
SSD 1 x Half-size Mini-PCIe socket support mSATA SSD
Watchdog timer 255 levels, 1 ~ 255 sec
Expansion 1 x Full-size Mini-PCIe socket w/SIM slot. With PCIe X1 & USB signal
1 x Half-size Mini-PCIe socket. With PCIe X1 or SATA , USB signal
Board Size 146mm x 101mm
Operating Temp. 0°C~60°C (32°F~140°F)
Storage Temp.
.-20°C~80°C (-4°F~176°F)
Operating Hum. 10%~90% (non-condensing)
Display
Chipset Intel® integrated
Display interface 2 x external HDMI 1.4a ( PTN3360D level shift. Supports 4096 * 2304 @ 24 Hz resolution )
1 x internal 24-bit Dual Channel LVDS (Chrontel CH7511. 1920*1080 resolution)
I/O
Serial Ports Internal: 1 x RS232/422/485 ( COM2 ), 3 x RS232 ( pitch : 2.0 )
SATA 1 x SATAIII-600
USB External: 2 x USB3.0 + 2 x USB2.0
Internal: 2 x USB2.0 ( pitch: 2.0mm)
Ethernet
External: 1 x Intel 1 x I218LM (IAMT 10)
Audio
Internal: Line-in/out, Mic-in (pitch : 2.0)
Digital I/O
8-bit GPIO interface (pitch: 2.0)
LPC 1 x LPC header for Optional TPM module (pitch: TBD)
Others 1 x CPU cooling Fan header (Smart fan support)
1 x Front Panel header for power on/off, reset, HDD/power LED indicator
1 x 2-pin header for battery, 1 x 4-pin DC out for SATA HDD
1 x LVDS Backlight/inverter pin-header