Wavecom WISMO Quik Q2501, Руководство по дизайну для клиентов

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WM_PRJ_Q2501_PTS_002 - 001
March 2004
confidential ©
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This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged
without prior written agreement.
Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à
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3.4.2 GPS serial links ..............................................................................48
3.4.3 Dead reckoning interface ...............................................................50
3.4.4 1.8 V Digital Power Supply for External Devices ............................52
3.4.5 GPS External Interruption ..............................................................52
3.4.6 GPS Antenna Power Supply ..........................................................52
3.5 RF part ..................................................................................................53
3.5.1 Antenna connection possibilities ...................................................53
3.5.2 GSM/GPRS antenna connection.....................................................54
3.5.3 GPS antenna connection ...............................................................55
3.5.4 Single coax connection ..................................................................59
4 PCB Design ................................................................................. 60
4.1 General Rules and Constraints ..............................................................60
4.2 Specific Routing Constraints .................................................................60
4.2.1 System Connector .........................................................................60
4.2.2 Power Supply ................................................................................60
4.2.3 SIM interface routing constraints...................................................62
4.2.4 Audio circuit routing constraints....................................................62
4.2.5 RF circuit routing constraints.........................................................63
4.3 Pads design...........................................................................................67
5 Mechanical Specifications .......................................................... 68
6 EMC and ESD recommendations................................................. 70
7 Firmware upgrade requirements ................................................. 71
8 Embedded Testability.................................................................. 72
8.1 Access to the serial link .........................................................................72
8.2 RF output accessibility for diagnostic ....................................................74
9 Manufacturers and suppliers ...................................................... 75
9.1 System connector .................................................................................75
9.2 SIM Card Reader ...................................................................................75
9.3 Microphone ...........................................................................................75
9.4 Speaker .................................................................................................76
9.5 RF cable ................................................................................................76
9.6 GSM antenna ........................................................................................76
9.7 GPS antenna .........................................................................................77
9.8 Buzzer ...................................................................................................77
10 Appendix .................................................................................. 78
10.1 80-pin PCB receptacle ...........................................................................79