TSSP57038H
www.vishay.com
Vishay Semiconductors
Rev. 1.3, 10-Apr-2019
6
Document Number: 82798
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
Note
(1)
MOQ: minimum order quantity
ORDERING INFORMATION
ORDERING CODE
PACKAGING
VOLUME
(1)
REMARKS
TSSP57038HTT1
Tape and reel
MOQ: 1500 pcs
3.95 mm x 3.95 mm x 0.75 mm
TSSP57038HTT2
MOQ: 5000 pcs
max. 120 s
max. 100 s
max. 20 s
Max. ramp up 3 °C/s
max. 260 °C
10
100
1000
10000
0
50
100
250
300
0
300
Axis Title
2nd l
ine
Temperature (°C)
Time (s)
250
200
150
100
50
200
150
245 °C
217 °C
240 °C
255 °C
Max. ramp down 6 °C/s
Max. 2 cycles allowed
19800
