VISHAY
TSOP61..
Document Number 82176
Rev. 3, 20-May-03
Vishay Semiconductors
www.vishay.com
7
• Recommended thickness of metal mask is 0.2 mm
for screen printing.
• The recommended reflow furnace is a combination-
type with upper and lower heaters.
• Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
keep the maximum temperature below 230 °C. The
following temperature profile means the tempera ture
at the device surface. Since temperature differ ence
occurs between the work and the surface of the circuit
board depending on the pes of circuit board or reflow
furnace, the operating conditions should be verified
prior to start of operation.
• Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
• Use the 6/4 solder or the solder containing silver.
• Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 °C.
• Finish soldering within three seconds.
• Handle products only after the temperature is cooled
off.
Cleaning
• Perform cleaning after soldering strictly in conform-
ance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol)
Commercially available grades (industrial use) should
be used.
Demineralized or distilled water having a resistivity of
not less than 500 m
Ω
corresponding to a conductivity
of 2 mS/m.
• Temperature and time: 30 seconds under the tem-
perature below 50 °C or 3 minutes below 30 °C.
• Ultrasonic cleaning: Below 20 W.
Reflow Solder Profile
10 s max.
@ 230
q
C
90 s max
0
20
40
60
80
100
120
140
160
180
200
220
240
0
50
100
150
200
250
300
350
Time ( s )
T
emperature ( C )
16944
q
2
q
C - 4
q
C/s
120 s - 180 s
2
q
C - 4
q
C/s
