V H P - V S 8 M
H E A T S I N K
VHP-VS8M Data Sheet
Rev 1.00, 05/2021
Page 5
Variscite Ltd.
NOTE: due to tolerances of the related components (heat sink, thermal pad, PCB, i.MX8M processor) there
might be a small gap between the heat sink
’s stands to the PCB itself. It is highly recommended
before
tightening all 4 nuts/screws to push the heat sink on top of the thermal pad so it will be squeezed on the
processor. Only afterwards tighten the top two screws, then the bottom ones close to the SO-DIMM
connector while paying attention when tightening the last screw that there is no extra pressure on the PCB
that might cause it to deform. If you see extra pressure is created on the PCB, you should not tighten the
screw all the way and use Loctite or similar glue to lock the screws. Another alternative is to use thermal
paste (grease) instead of thermal pad which bridges the gap between the processor and the heat sink in
different tolerances of the related components. The thermal paste should have similar thermal conductivity
as the thermal pad, 6.0 watt/m-k (by JIS R2618 / ASTM D2326 standard).
Heat Sink assembly sketch
