USound GmbH | MEMS Speakers Handling Guide
Released on July 2019
www.usound.com | [email protected]
3
SOLDERING
Temperatures at which MEMS speakers are exposed during soldering can potentially damage the component
if not done correctly. Apply soldering iron only on the electrical pads on the bottom side of the speaker during
the soldering process. It’s recommended to follow the standard IPC J-STD-001 “Requirements for Soldered
Electrical and Electronic Assemblies.” For inspection, it‘s suggested to follow IPC-A-610G.
RECOMENDATIONS
Type
Recommended Parameters
Comments
Soldering Temperature
340°C (Possible range: 290 - 400°C)
Adjust with the soldering station
Soldering Time
1-2 s (maximum 5 s)
Keep contact duration short
Soldering Iron Tip
Weller LT 1S 0.2 mm – 0.4 mm
Fine solder tip for precise soldering
Soldering Station
JBC DDE 2 Tools
User preference
Soldering Wire
RS-756-884 0.71 mm Lead Free
EDSYN SU35100 with Flux
EDSYN SSAC2010 0.2 mm Lead Free
Use lead-free soldering wire
Flux
Chemtronics CW8100
Flux Dispensing Pen
Avoid excess application
SOLDERING PROCESS
1. Tin the copper wire or use pre-tinned wires to sim-
plify the soldering process.
2. Locate the copper pads of the loudspeaker and
apply solder on the speaker pads by using a solde-
ring iron.
3. Solder the wire onto the pads of the speaker.
The materials of the protection
sheet can melt during the solde-
ring process. Make sure not to
touch the protection sheet when
soldering.
