14
Hardware Design
UC-00-M48 EN R1.1
3.5
Recommended PCB Package Design
See the following figure for the recommended PCB package design of the module
UM960L.
Unit
：
mm
Detail A
1.00
1.10
3.00
1.10
1.00
16.00
12
1.00
3.30
12
.20
13
24
1
1.50
2.00
1.40
3.30
1.40
1.00
Detail C
Detail B
Detail C
Detail B
0.76
0.91
2.49
2.64
Detail A
Copper
Solder
1.12
1.22
0.51
0.66
1.12
3.50
1.22
3.66
Figure 3-4 Recommended PCB Package Design
Remark:
For the convenience of testing, the soldering pads of the pins are designed long,
exceeding the module border much more. For example:
The pads denoted as detail C are 1.50 mm longer than the module border.
The pad denoted as detail A is 0.49 mm longer than the module border. It is
relatively short as it is an RF pin pad, so we hope the trace on the surface is as
short as possible to reduce the impact of interference.
In order to effectively reduce the possibility of solder bridge during the soldering,
the pin pads are designed narrower than the pins. However, the pad denoted as
detail A has the same width as the pin, as we hope the resistance is as continuous
as possible at the RF pin.
