Doc. No: Unex-QSG-21-003
21/23
A printed version of this document is an uncontrolled copy
© 2021 Unex Technology Corporation – Company Confidential
Figure 9: Thermally conductive pad area
10.
Dimensions and Weight
The SOM-301(v2)/SOM-351 module follows the PCIe full-mini card form factor, but
8.5mm wider than the standard 30mm width. When designing a system board, at least 3mm
clearance on both left and right side is needed to avoid component interference. It is also
recommended to reserve 13mm as total height limitation. Please refer to
PCI Express Mini
Card Electromechanical Specification 2.0/2.1
for more detailed guidelines.
It is recommended to use a mini PCIe connector with 4mm stack height, leaving 1.5mm
space between the SOM-301(v2)/SOM-351 PCB and the system board. This space can
later be filled with silicone thermal conductive pad to help dissipate the heat generated by
SOM-301(v2)/SOM-351 to the system board PCB. User can choose
TE 2041119-1
as a
candidate for such a mini PCIe connector.
30mm
30mm