Ublox TOBY-R2 Series, Руководство по системной интеграции

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TOBY-R2 series - System integration manual
UBX-16010572 - R10 Design-in Page 118 of 151
2.11 Module footprint and paste mask
Figure 67 and Table 50 describe the suggested footprint (i.e. copper mask) layout for TOBY-R2 series
modules. The proposed land pattern layout slightly reflects the modules’ pads layout, with most of
the lateral pads designed wider on the application board (1.8 x 0.8 mm) than on the module
(1.5 x 0.8 mm).
I1
A
G H J1 D F2
K M1 M1 M2
P2
B G
H
J
O
O
L
N
M1 M1 M3
I1
I1
O H
J
J
J
E
P3
F1
P1
H
I1
O
I2
I2
F2
Module placement outline
Figure 67: TOBY-R2 series module suggest footprint (application board top view)
Parameter Value Parameter Value Parameter Value
A 35.6 mm H 0.80 mm M2 5.20 mm
B 24.8 mm I1 1.50 mm M3 4.50 mm
D 2.40 mm I2 1.80 mm N 2.10 mm
E 2.25 mm J 0.30 mm O 1.10 mm
F1 1.45 mm K 3.15 mm P1 1.10 mm
F2 1.30 mm L 7.15 mm P2 1.25 mm
G 1.10 mm M1 1.80 mm P3 2.85 mm
Table 50: TOBY-R2 series module suggest footprint dimensions
The Non Solder resist Mask Defined (NSMD) pad type is recommended over the Solder resist Mask
Defined (SMD) pad type, implementing the solder mask opening 50
µ
m larger per side than the
corresponding copper pad.
The suggested paste mask layout for TOBY-R2 series modules slightly reflects the copper mask
layout described in
Figure 67 and Table 50 , as different stencil apertures layout for any specific pad is
recommended:
 Blue marked pads: Paste layout reduced circumferentially about 0.025 mm to Copper layout
 Green marked pads: Paste layout enlarged circumferentially about 0.025 mm to Copper layout

Purple marked pads: Paste layout one to one to Copper layout
The recommended solder paste thickness is 150
µ
m, according to application production process
requirements.
☞
These are recommendations only and not specifications. The exact mask geometries, distances
and stencil thicknesses must be adapted to the specific production processes (e.g. soldering etc.)
of the customer.