Ublox TIM-5H, Руководство по интеграции оборудования

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TIM-5H - Hardware Integration Manual Product Handling
GPS.G5-MS5-07015-A-1 u-blox proprietary Page 34
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The final soldering temperature chosen at the factory depends on additional external factors like choice of
soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering
temperature in the recommended soldering profile may permanently damage the module.
Preheat
0
50 100 150 200 250 300
50
100
150
200
250
Heating Cooling
50
100
150
200
250
max 1- 4 °C/s
max 60 - 120 s
Peak Temp.
230 - 250 °C
Liquidus Temperature
116 - 221
[°C]
Elapsed Time [s]
max 20 - 40 s
Typical Leadfree
Soldering Profile
End Temp.
150 - 200 °C
max 3 °C/s
[°C]
Figure 22: Recommended soldering profile
When soldering leadfree (u-blox 5) modules in a leaded process, check the following temperatures:
o
PB- Technology Soaktime: 40-80sec
o
Time above Liquidus: 40-90 sec
o
Peak temperature: 225-235 °C
TIM-5H modules must not be soldered with a damp heat process.
3.3.4 Optical Inspection
After soldering the TIM-5H module, consider an optical inspection step to check whether:
•
The module is properly aligned and centered over the pads
•
All pads are properly soldered
•
No excess solder has created contacts to neighboring pads, or possibly to pad stacks and vias nearby.