SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R11
Design-in
Page 114 of 157
2.11
Module footprint and paste mask
describe the suggested footprint (i.e. copper mask) and paste mask layout for SARA
modules: the proposed land pattern layout reflects the modules’ pins layout, while the proposed stencil
apertures layout is slightly different (see the F’’, H’’, I’’, J’’, O’’ parameters compared to the F’, H’, I’, J’, O’
ones).
The Non Solder resist Mask Defined (NSMD) pad type is recommended over the Solder resist Mask Defined
(SMD) pad type, as it implements the solder resist mask opening 50
µ
m larger per side than the
corresponding copper pad.
The recommended thickness of the stencil for the soldering paste is 150
µ
m, according to application
production process requirements.
K
M 1
M 1
M 2
E
G
H’
J ’
E
ANT pin
B
Pin 1
K
G
H’
J ’
A
D
D
O’
O’
L
N
L
I’
F’
F’
K
M 1
M 1
M 2
E
G
H’’
J ’’
E
ANT pin
B
Pin 1
K
G
H’’
J ’’
A
D
D
O’’
O’’
L
N
L
I’’
F’’
F’’
St encil: 150
µ
m
Figure 54: SARA-R4/N4 series modules suggested footprint and paste mask (application board top view)
Parameter
Value
Parameter
Value
Parameter
Value
A
26.0 mm
G
1.10 mm
K
2.75 mm
B
16.0 mm
H’
0.80 mm
L
2.75 mm
C
3.00 mm
H’’
0.75 mm
M1
1.80 mm
D
2.00 mm
I’
1.50 mm
M2
3.60 mm
E
2.50 mm
I’’
1.55 mm
N
2.10 mm
F’
1.05 mm
J’
0.30 mm
O’
1.10 mm
