LEA-6 / NEO-6 / MAX-6 - Hardware Integration Manual
UBX-14054794
Production Information
Product handling
Page 57 of 85
3.2.9
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal
®
or other related coating products.
These materials affect the HF properties of the GPS module and it is important to prevent them from flowing
into the module. The RF shields do not provide 100% protection for the module from coating liquids with low
viscosity; therefore care is required in applying the coating.
Conformal Coating of the module will void the warranty.
3.2.10
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such
processes in combination with the u-blox 6 module before implementing this in the production.
Casting will void the warranty.
3.2.11
Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the
EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to provide
optimum immunity to interferences and noise.
u-blox makes no warranty for damages to the u-blox 6 module caused by soldering metal cables or any
other forms of metal strips directly onto the EMI covers.
3.2.12
Use of ultrasonic processes
Some components on the u-blox 6 module are sensitive to Ultrasonic Waves. Use of any Ultrasonic Processes
(cleaning, welding etc.) may cause damage to the GPS Receiver.
u-blox offers no warranty against damages to the u-blox 6 module caused by any Ultrasonic Processes.
3.3
EOS/ESD/EMI Precautions
When integrating GPS receivers into wireless systems, careful consideration must be given to electromagnetic
and voltage susceptibility issues. Wireless systems include components which can produce Electrical Overstress
(EOS) and Electro-Magnetic Interference (EMI). CMOS devices are more sensitive to such influences because their
failure mechanism is defined by the applied voltage, whereas bipolar semiconductors are more susceptible to
thermal overstress. The following design guidelines are provided to help in designing robust yet cost effective
solutions.
To avoid overstress damage during production or in the field it is essential to observe strict
EOS/ESD/EMI handling and protection measures.
To prevent overstress damage at the RF_IN of your receiver, never exceed the maximum input
power (see Data Sheet).
3.3.1
Abbreviations
For a list of abbreviations used see
3.3.2
Electrostatic discharge (ESD)
Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between
two objects at different electrical potentials caused by direct contact or induced by an
electrostatic field. The term is usually used in the electronics and other industries to describe
momentary unwanted currents that may cause damage to electronic equipment.