EVA-M8M - Hardware Integration Manual
2.11.1
Footprint
Figure 5: Recommended footprint (bottom view)
Units are in mm.
2.11.2
Paste mask
The paste mask
shall be 50 µm smaller than the copper pads with a paste thickness of 100 µm.
The paste mask outline needs to be considered when defining the minimal distance to the next
component.
These are recommendations only and not specifications. The exact geometry, distances, stencil thicknesses
and solder paste volumes must be adapted to the specific production processes (e.g. soldering etc.) of the
customer.
2.11.3
Placement
A very important factor in achieving maximum GNSS performance is the placement of the receiver on the PCB.
The connection to the antenna must be as short as possible to avoid jamming into the very sensitive RF section.
Make sure that RF critical circuits are clearly separated from any other digital circuits on the system board. To
achieve this, position the receiver digital part towards your digital section of the system PCB. Care must also be
exercised with placing the receiver in proximity to circuitry that can emit heat. The RF part of the receiver is very
sensitive to temperature and sudden changes can have an adverse impact on performance.
High temperature drift and air vents can affect the GNSS performance. For best performance avoid high
temperature drift and air vents near the module.
Pin1
Pin36
UBX-14006179 - R01
Advance Information
Design-in
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