Ublox EVA-7M, Руководство пользователя

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EVA-7M - Hardware Integration Manual
UBX-12003235 - R05 Production Information Contents
Page 4 of 42
2.12.1 Abbreviations .............................................................................................................................. 21
2.12.2 Electrostatic Discharge (ESD) ........................................................................................................ 21
2.12.3 ESD protection measures ............................................................................................................. 22
2.12.4 Electrical Overstress (EOS) ............................................................................................................ 22
2.12.5 EOS protection measures ............................................................................................................. 22
2.12.6 Applications with cellular modules .............................................................................................. 23
3 Product handling & soldering .................................................................................... 25
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 25
3.2 ESD handling precautions ................................................................................................................... 25
3.3 Soldering ............................................................................................................................................ 25
3.3.1 Soldering paste............................................................................................................................ 25
3.3.2 Reflow soldering ......................................................................................................................... 26
3.3.3 Optical inspection ........................................................................................................................ 26
3.3.4 Repeated reflow soldering ........................................................................................................... 26
3.3.5 Wave soldering............................................................................................................................ 26
3.3.6 Rework ........................................................................................................................................ 26
3.3.7 Use of ultrasonic processes .......................................................................................................... 26
4 Product testing ........................................................................................................... 27
4.1 Test parameters for OEM manufacturer .............................................................................................. 27
4.2 System sensitivity test ......................................................................................................................... 27
4.2.1 Guidelines for sensitivity tests ...................................................................................................... 27
4.2.2 ‘Go/No go’ tests for integrated devices ........................................................................................ 27
Appendix .......................................................................................................................... 28
A Reference schematics ................................................................................................. 28
A.1 Cost optimized circuit ......................................................................................................................... 28
A.2 Best performance circuit with passive antenna .................................................................................... 29
A.3 Improved jamming immunity with passive antenna ............................................................................. 30
A.4 Circuit using active antenna ................................................................................................................ 31
A.5 USB self-powered circuit with passive antenna ................................................................................... 32
A.6 USB bus-powered circuit with passive antenna ................................................................................... 33
A.7 Circuit using 2-pin antenna supervisor ................................................................................................ 34
A.8 Circuit using 3-pin antenna supervisor ................................................................................................ 35
A.9 Design-in Recommendations in combination with cellular operation ................................................... 36
B Component selection ................................................................................................. 37
B.1 External RTC (Y1) ................................................................................................................................ 37
B.2 RF band-pass filter (F1) ....................................................................................................................... 37
B.3 External LNA protection filter (F2) ....................................................................................................... 38
B.4 USB line protection (D1) ..................................................................................................................... 38
B.5 USB LDO (U2) ..................................................................................................................................... 38
B.6 External LNA (U1) ............................................................................................................................... 38