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NINA-B1 series - System Integration Manual 

UBX-15026175 - R06

 

 

Design-in 

 

 

Page 36 of 48

 

 

These are recommendations only and not specifications. The exact mask geometries, 

distances,  and stencil thicknesses must be adapted to the specific production processes of the 
customer. 

3.8

 

Thermal guidelines 

The NINA-B1 series modules have been successfully tested in -40 °C to +85 °C. The NINA-B1 series module is a 
low power device and will generate only a small amount of heat during operation. A good grounding should still 
be observed for temperature relief during high ambient temperature.  

3.9

 

ESD guidelines 

The immunity of devices integrating NINA-B1  modules to Electro-Static Discharge (ESD) is part of the  
Electro-Magnetic Compatibility (EMC) conformity,  which is required for products bearing the CE marking, 
compliant with the R&TTE Directive (99/5/EC), the EMC Directive (89/336/EEC) and the Low Voltage Directive 
(73/23/EEC) issued by the Commission of the European Community. 
Compliance with these directives implies conformity to the following European Norms for device ESD immunity: 
ESD testing standard 

CENELEC EN 61000-4-2 

and the radio equipment standards 

ETSI EN 301 489-1

ETSI EN 

301 489-7

ETSI EN 301 489-24

, the requirements of which are summarized in Table 10. 

The ESD immunity test is performed at the enclosure port, defined by 

ETSI EN 301 489-1 

as the physical 

boundary through which the electromagnetic field radiates. If the device implements an integral antenna, the 
enclosure port is seen as all insulating and conductive surfaces housing the device. If the device implements a 
removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the 
antenna element and its interconnecting cable surfaces. 
The applicability of ESD immunity test to the whole device depends on the device classification as defined by 

ETSI 

EN 301 489-1

. Applicability of ESD immunity test to the related  device ports or the related  interconnecting 

cables to auxiliary equipment, depends on device accessible interfaces and manufacturer requirements, as 
defined by 

ETSI EN 301 489-1

Contact discharges are performed at conductive surfaces, while air discharges are performed at insulating 
surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling 
planes as defined in 

CENELEC EN 61000-4-2

 

For the definition of integral antenna, removable antenna, antenna port, device classification refer to the 

ETSI EN 301 489-1

. For the contact and air discharges definitions refer to 

CENELEC EN 61000-4-2

Application 

Category 

Immunity Level 

All exposed surfaces of the radio equipment and ancillary equipment in a 
representative configuration 

Indirect Contact Discharge 

±8 kV 

Table 10: Electro-Magnetic Compatibility ESD immunity requirements as defined by CENELEC EN 61000-4-2, ETSI EN 301 489-1, 
ETSI EN 301 489-7, ETSI EN 301 489-24 

NINA-B1 is manufactured taking into account specific standards to minimize the occurrence of ESD events; the 
highly automated process complies with IEC61340-5-1 (STM5.2-1999 Class M1 devices) standard thus the 
designer should implement proper measures to protect from ESD events, any pin that may be exposed to the 
end user. 
Compliance with standard protection level specified in EN61000-4-2  can be achieved by including  ESD 
protections in parallel to the line, close to areas accessible by the end user. 
 
 

Содержание NINA-B1 Series

Страница 1: ...stand alone Bluetooth low energy modules With embedded Bluetooth low energy profiles and services these modules are tailored for OEMs who wish to embed their own application on top of the available B...

Страница 2: ...os and designs described herein may in whole or in part be subject to intellectual property rights Reproduction use modification or disclosure to third parties of this document or any part thereof wit...

Страница 3: ...1 4 1 Module reset 11 1 4 2 Internal temperature sensor 11 1 5 Debug Serial Wire Debug SWD 11 1 6 Serial interfaces 12 1 6 1 Universal Asynchronous Serial Interface UART 12 1 6 2 Serial Peripheral In...

Страница 4: ...General considerations for schematic design and PCB floor planning 35 3 6 2 Module placement 35 3 6 3 Layout and manufacturing 35 3 7 Module footprint and paste mask 35 3 8 Thermal guidelines 36 3 9 E...

Страница 5: ...ation to run on the built in Cortex M4F With 512 kB flash and 64 kB RAM it offers the best in class capacity for customer applications running on top of the Bluetooth low energy stack using SDK from N...

Страница 6: ...own application developed with either ARM mbed Nordic SDK or Wirepas development environment inside the NINA B1 module The different software options are described in more detail in section 2 1 2 Pin...

Страница 7: ...op view The grey pins in the center of the modules are GND pins The outline of NINA B111 ends at the dotted line as shown in Figure 2 where the antenna area of NINA B112 begins All digital or analog f...

Страница 8: ...an NFC field to the NFC pins when they are configured as GPIOs Doing so may cause permanent damage to the module When driving different logic levels on these pins in GPIO mode a small current leakage...

Страница 9: ...rounding SWITCH_1 and SWITCH_2 during a reset and holding it low for 10s will make the module restore all factory settings GPIO_16 16 P0 28 I O General purpose I O Pin is analog capable UART_DTR Can b...

Страница 10: ...ain supply input The NINA B1 series uses an integrated DC DC converter to transform the supply voltage presented at the VCC pin into a stable system core voltage Due to this the NINA B1 modules are co...

Страница 11: ...iciency at extremely light loads a typical DC DC efficiency quickly degrades as idle current drops below a few mA greatly reducing the battery life Due to the low current consumption and wide voltage...

Страница 12: ...nect and or toggle connectable status Enable disable the rest of the UART interface Enter wake up from the sleep mode See the NINA B1 series Data Sheet 2 for characteristic information about the UART...

Страница 13: ...t Event trigger Interrupt event trigger to the software application Wake up event Any ADC input 8 10 12 bit analog to digital converter Any analog Analog comparator input Compare two voltages capable...

Страница 14: ...gh a 50 transmission line to allow reception of radio frequency RF signals in the 2 4 GHz frequency band Choose an antenna with optimal radiating characteristics for the best electrical performance an...

Страница 15: ...ional emission levels produced by the end product The module may be integrated with other antennas In this case the OEM installer must certify his design with respective regulatory agencies 1 8 2 Inte...

Страница 16: ...connectivity software The u blox connectivity software enables the use of the Bluetooth Low Energy functions controlled by AT commands over the UART interface Examples of supported features are u blo...

Страница 17: ...l it automatically e Read the information in the SDK Release Notes and check the nRF5 Software Development Kit documentation available at http infocenter nordicsemi com Nordic tools More information a...

Страница 18: ...fine BUTTONS_ACTIVE_STATE 0 define BUTTONS_LIST BUTTON_1 BUTTON_2 define BSP_BUTTON_0 BUTTON_1 define BSP_BUTTON_1 BUTTON_2 define RX_PIN_NUMBER 5 define TX_PIN_NUMBER 6 define CTS_PIN_NUMBER 7 define...

Страница 19: ...bed CLI is the name of the ARM mbed command line tool which enables the full mbed workflow such as repositories version control maintaining dependencies updating from remotely hosted repositories GitH...

Страница 20: ...inNames h file should declare and define a couple of enumerations to configure the custom pin mapping Figure 6 and Figure 7 show the contents of the PinNames h file in the case of EVK NINA B1 ifndef M...

Страница 21: ...clude cmsis h ifdef __cplusplus extern C endif typedef enum PIN_INPUT PIN_OUTPUT PinDirection define PORT_SHIFT 3 typedef enum nRF52 pin names p0 0 p1 1 p2 2 p3 3 p4 4 p5 5 p6 6 p7 7 p8 8 p9 9 p10 10...

Страница 22: ...VK NINA B1 board LED1 NINA_B1_GPIO_1 Red LED2 NINA_B1_GPIO_7 Green SW1 LED3 NINA_B1_GPIO_8 Blue LED4 NC SW1 NINA_B1_GPIO_7 SW2 NINA_B1_GPIO_18 D0 NINA_B1_GPIO_23 D1 NINA_B1_GPIO_22 D2 NINA_B1_GPIO_21...

Страница 23: ...ng of u blox connectivity software is normally done over UART If the flash is erased or any other software is flashed on the NINA B1 module then the SoftDevice and the u blox bootloader must be flashe...

Страница 24: ...contains the bootloader and SoftDevice 3 Set the correct COM port and the desired speed and click Update button 4 The module will then reboot into the bootloader and the flashing will start A command...

Страница 25: ...contains the application Keep in mind that the bootloader will time out and resume the application after 10 seconds Flashing must have started before the time out and resuming of the application 2 3 2...

Страница 26: ...x hex When developing and flashing applications based on the Nordic SDK it is recommended to do an Erase all to remove the u blox connectivity software and its stored parameters before flashing down t...

Страница 27: ...ng the Bluetooth device address When the new u blox connectivity software is flashed to the module it is important to restore the Bluetooth device address as well Step 1 To enable writing of the Bluet...

Страница 28: ...and output pins Accurate design is required to guarantee that the voltage level is well defined during module boot 6 Other pins Accurate design is required to guarantee proper functionality 3 2 Anten...

Страница 29: ...minimized to reduce dielectric losses o If traces longer than few centimeters are needed it is recommended to use a coaxial connector and cable to reduce losses o Stack up should allow for thick 50 tr...

Страница 30: ...o Internal integrated antennas imply physical restriction to the PCB design Integrated antenna excites RF currents on its counterpoise typically the PCB ground plane of the device that becomes part o...

Страница 31: ...Select antennas that provide appropriate gain figure that is combined antenna directivity and efficiency figure so that the electromagnetic field radiation intensity does not exceed the regulatory lim...

Страница 32: ...igned by an antenna manufacturer providing the best possible return loss or VSWR Provide a ground plane large enough according to the related integrated antenna requirements The ground plane of the ap...

Страница 33: ...C connection must be routed through a PCB area separated from sensitive analog signals and sensitive functional units It is a good practice to interpose at least one layer of PCB ground between VCC tr...

Страница 34: ...capacitor value is given by the below equations An antenna inductance of Lant 2 H will give tuning capacitors in the range of 130 pF on each pin For good performance match the total capacitance on NF...

Страница 35: ...nal quality Verify the recommended maximum signal skew for differential pairs and length matching of buses Minimize the routing length longer traces will degrade signal performance Ensure that maximum...

Страница 36: ...a the antenna port can be separated from the enclosure port The antenna port includes the antenna element and its interconnecting cable surfaces The applicability of ESD immunity test to the whole dev...

Страница 37: ...ocal GND and PCB GND Before mounting an antenna patch connect ground of the device When handling the RF pin do not come into contact with any charged capacitors and be careful when contacting material...

Страница 38: ...cycles 1 Table 11 Recommended reflow profile Figure 14 Reflow profile Lower value of TP and slower ramp down rate 2 3 C sec is preferred After reflow soldering optical inspection of the modules is re...

Страница 39: ...r boards populated with the modules Miniature Wave Selective Solder process is preferred over traditional wave soldering process Hand soldering is not recommended Rework is not recommended Conformal c...

Страница 40: ...NINA B1 series System Integration Manual UBX 15026175 R06 Qualifications and approvals Page 40 of 48 5 Qualifications and approvals For regulatory information see the NINA B1 series Datasheet 2...

Страница 41: ...such as receiver RSSI calibration frequency tuning of reference clock calibration of transmitter power levels and so on Figure 15 Automatic test equipment for module test 6 2 OEM manufacturer product...

Страница 42: ...ormed after establishing a connection with an external device A very simple test can be performed by just scanning for a known Bluetooth low energy device and checking the signal level These kinds of...

Страница 43: ...try Canada I2 C Inter Integrated Circuit LDO Low Drop Out LED Light Emitting Diode MAC Media Access Control MSL Moisture Sensitivity Level NSMD Non Solder Mask Defined PCB Printed Circuit Board RF Rad...

Страница 44: ...d parts for antenna matching PCB layout must be identical to the one provided by u blox please implement one of the reference designs included in this section or contact u blox The designer must use t...

Страница 45: ...Should have a solid GND inner layer under and around the RF components vias and small openings are allowed 4 RF trace Antenna coplanar microstrip matched to 50 5 GND trace Green Minimum required top...

Страница 46: ...race required around the RF trace and pins GND stitching vias should be used around the RF trace to ensure a proper GND connection No other components are allowed within this area The solid GND layer...

Страница 47: ...nology equipment Safety Part 1 General requirements 12 FCC Regulatory Information Title 47 Telecommunication 13 JESD51 Overview of methodology for thermal testing of single semiconductor devices 14 No...

Страница 48: ...m Regional Office China Beijing Phone 86 10 68 133 545 E mail info_cn u blox com Support support_cn u blox com Regional Office China Chongqing Phone 86 23 6815 1588 E mail info_cn u blox com Support s...

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