JODY-W2 - System integration manual
UBX-18068879 - R14
Design-in
Page 31 of 84
C1 - Public
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The heat dissipation during continuous transmission at maximum power can significantly raise
the temperature of the application baseboard below the JODY-W2 series modules. Avoid placing
temperature sensitive devices close to the module and provide adequate grounding to transfer
the generated heat to the PCB.
2.7
Module footprint and paste mask
Figure 9: Recommended footprint for JODY-W2 module, top view (dimensions in mm, ±.05 mm)
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Future variants of JODY-W2 can have more pins in the area enclosed with dotted lines. To ensure
compatibility, keep this area free of copper.