EVA-M8E - Hardware Integration Manual
UBX-15028542 - R05
Contents
Page 27 of 44
Production Information
The paste-mask geometry for applying soldering paste should meet the recommendations given in
section 2.11.2.
4.3.2
Reflow soldering
Preheat/ Soak Temperature min.
Preheat/ Soak Temperature max.
Preheat/ Soak Time from T
smin
to T
smax
T
smin
T
smax
T
s
(T
smin
to T
smax
)
150°C
180°C
< 90 seconds
Liquidus Temperature
Time maintained above T
L
T
L
t
L
217°C
40 to 60 seconds
Peak Package Body Temperature
T
P
250°C
Ramp up rate (T
L
to T
P
)
3°C/ second max.
Time 0°C…-5°C of T
P
30 seconds
Ramp down rate (T
P
to T
L
)
4°C/ second max.
Table 6: Recommended conditions for reflow process
The peak temperature must not exceed 250°C. The time above 245°C must not exceed 30 seconds.
☞
EVA-M8E
must not
be soldered with a damp heat process.
4.3.3
Optical inspection
After soldering the EVA-M8E module, consider an optical inspection step to check whether:
•
The module is properly aligned and centered over the pads
4.3.4
Repeated reflow soldering
Only single reflow soldering processes is recommended for boards populated with EVA-M8E module.
4.3.5
Wave soldering
Base boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices require wave soldering to solder the THT components. Only a single wave
soldering process is encouraged for boards populated with EVA-M8E.
4.3.6
Rework
Not recommended.
4.3.7
EOS/ESD/EMI precautions
When integrating GNSS positioning modules into wireless systems, careful consideration must be
given to electromagnetic and voltage susceptibility issues. Wireless systems include components
that can produce Electrical Overstress (EOS) and Electro-Magnetic Interference (EMI). CMOS devices
are more sensitive to such influences because their failure mechanism is defined by the applied
voltage, whereas bipolar semiconductors are more susceptible to thermal overstress. The following
design guidelines are provided to help in designing robust yet cost effective solutions.
⚠
To avoid overstress damage during production or in the field it is essential to observe strict
EOS/ESD/EMI handling and protection measures.
⚠
To prevent overstress damage at the RF_IN of your receiver, never exceed the maximum input
power (see the EVA-M8E Data Sheet [1]).
