EVA-M8E - Hardware Integration Manual
UBX-15028542 - R05
Contents
Page 21 of 44
Production Information
2.11.1
Footprint
Figure 5: Recommended footprint (bottom view)- units are in mm
2.11.2
Paste mask
The paste mask
shall be 50 µm smaller than the copper pads with a paste thickness of 100 µm.
The paste mask outline needs to be considered when defining the minimal distance to the next
component.
These are recommendations only and not specifications. The exact geometry, distances, stencil
thicknesses and solder paste volumes must be adapted to the specific production processes (e.g.
soldering etc.) of the customer.
2.11.3
Placement
A very important factor in achieving maximum GNSS performance is the placement of the receiver on
the PCB. The connection to the antenna must be as short as possible to avoid jamming into the very
sensitive RF section.
Make sure that RF critical circuits are clearly separated from any other digital circuits on the system
board. To achieve this, position the receiver digital part towards your digital section of the system
PCB. Care must also be exercised with placing the receiver in proximity to circuitry that can emit heat.
The RF part of the receiver is very sensitive to temperature and sudden changes can have an adverse
impact on performance.
⚠
High temperature drift and air vents can affect the GNSS performance. For best performance
avoid high temperature drift and air vents near the module.
Pin1
Pin36
