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2.6 - Thermal Interface Material
There are two types of
thermal interface materials
designed for use with the
processors.
The most common material
comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat
sink on the processor.
The second type of interface
material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).
Always check with the manufacturer of the heat sink & processor to
ensure the thermal Interface material is compatible with the processor
and meets the manufacturer’s warranty requirements.
Содержание S8228
Страница 2: ...http www TYAN com 2...
Страница 8: ...http www TYAN com 8...
Страница 11: ...http www TYAN com 11 2 2 Block Diagram S8228 Block Diagram Represents all SKUs...
Страница 19: ...http www TYAN com 19 B Step3 Close the socket cover and press the CPU lever down to secure the CPU...
Страница 40: ...http www TYAN com 40 3 7 2 1 IDE Configuration Sub Menu...
Страница 44: ...http www TYAN com 44 3 7 4 1 General ACPI Configuration sub menu 3 7 4 2 Advanced ACPI Configuration sub menu...
Страница 47: ...http www TYAN com 47 3 7 5 1 Sensor Data Configuration Sub Menu Read only It can not be modified in user mode...
Страница 49: ...http www TYAN com 49 3 7 6 1 View BMC System Event Log Sub Menu Read only It can not be modified in user mode...
Страница 50: ...http www TYAN com 50 3 7 6 2 LAN Configuration Sub Menu...
Страница 70: ...http www TYAN com 70 3 10 3 1 PCI Express Configuration Sub Menu...
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Страница 84: ...http www TYAN com 84 NOTE...