
6
PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
(the total exposure time cannot exceed 168 hours).
–
SMT equipment:
∗ Mounter
∗ SPI
∗ Reflow soldering machine
∗ Oven temperature tester
∗ Automated optical inspection (AOI) equipment
–
Baking equipment:
∗ Cabinet oven
∗ Anti-static heat-resistant pallets
∗ Anti-static heat-resistant gloves
• Storage conditions for a delivered module are as follows:
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The moisture-proof bag must be placed in an environment where the tem-
perature is below 40°C and the relative humidity is lower than 90%.
–
The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.
–
The package contains a humidity indicator card (HIC).
• The module needs to be baked in the following cases:
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Vacuum packing bag was found to be damaged before being unpacked.
–
There is no humidity indicator card (HIC) in the vacuum packing bag.
–
After being unpacked, 10% and above circles on the HIC become pink.
–
The total exposure time has been more than 168 hours since unpacking.
–
More than 12 months have passed since the sealing date of the bag.
• Baking settings:
–
Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for
palletizing (please use heat-resistant pallet rather than plastic pallet)
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