User's Manual l TQMLS10xxA UM 0105 l © 2022, TQ-Systems GmbH
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5.4
Adaptation to the environment
The TQMLS10xxA overall dimensions (length × width) are 80 × 60 mm
2
.
The CPU on the TQMLS10xxA has a maximum height of approximately 8.6 mm above the MBLS10xxA.
The TQMLS10xxA weighs approximately 33 grams.
5.5
Protection against external effects
As an embedded module, the TQMLS10xxA is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system.
5.6
Thermal management
The cooling system for the TQMLS1088A should be designed to dissipate a maximum of approximately 20 watts.
The power consumption of TQMLS1043A and TQMLS1046A are significantly lower, see Table 4.
The power dissipation originates primarily in the CPU and the DDR4 SDRAM.
The power dissipation also depends on the software used and can vary according to the application.
Attention: Destruction or malfunction, TQMLS10xxA heat dissipation
The TQMLS10xxA belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA
package, thermal pad, heatsink) as well as the maximum pressure on the LS10xxA must be taken into
consideration when connecting the heat sink, see (2).
The LS10xxA is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMLS10xxA and thus malfunction, deterioration or destruction.
5.7
Structural requirements
The TQMLS10xxA is held in the mating connectors by the retention force of the pins (420). If high requirements are set for
vibration and shock resistance, additional fastening via the mounting holes is possible in the final application.
5.8
Notes of treatment
To avoid damage caused by mechanical stress, the TQMLS10xxA may only be extracted from the carrier board by using the
extraction tool MOZI52XX that can also be obtained separately.
Note: Component placement on carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the TQMLS10xxA
for the extraction tool MOZI52XX.
6.
SOFTWARE
The TQMLS10xxA is delivered with a preinstalled boot loader and a BSP, which is configured for the Starterkit MBLS10xxA.
Documentation and BSPs can be found in the respective TQ-Support Wiki, see (1.9).
The boot loader provides TQMLS10xxA-specific as well as board-specific settings, e.g.:
•
CPU configuration
•
PMIC configuration
•
DDR4 SDRAM configuration and timing
•
eMMC configuration
•
Multiplexing
•
Clocks
•
Pin configuration
•
Driver strengths
