User's Manual l TQMLS10xxA UM 0105 l © 2022, TQ-Systems GmbH
Page 12
4.7.5
Power consumption
The given power consumptions have to be seen as typical values. The power consumption of the TQMLS10xxA strongly depends
on the application, the mode of operation, the environmental temperature, and the operating system.
The power supply of the carrier board should be designed for an output power of 18 to 20 watts.
The following table shows typical power consumption of the TQMLS10xxA under various operating conditions.
Table 4:
TQMLS10xxA power consumption @ 5 V
Mode of operation
TQMLS1043A
TQMLS1046A
TQMLS1088A
T
environment
U-Boot, idle
4.08 W
7 W
8.64 W
+25 °C
U-Boot, memory test
4.24 W
8.4 W
9.44 W
Linux, idle
3.92 W
7.1 W
8 W
Linux, 100 % CPU load
6 W (1)
11.9 W (2)
12.32 W (3)
U-Boot, idle
5.76 W
11.6 W
12.76 W
+85 °C
U-Boot, memory test
6.72 W
14.2 W
15.72 W
Linux, 100 % CPU load
8.05 W (1)
15.6 W (2)
18.9 W (3)
Attention: Destruction or malfunction, TQMLS10xxA heat dissipation
The TQMLS10xxA belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA
package, thermal pad, heatsink) as well as the maximum pressure on the LS10xxA must be taken into
consideration when connecting the heat sink, see (2).
The LS10xxA is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMLS10xxA and thus malfunction, deterioration or destruction.
1:
stressapptest -s 3600 -M 700 -m 4 -C 4 -i 4
2:
stressapptest -s 3600 -M 1024 -m 4 -C 4 -i 4
3:
stressapptest -s 3600 -M 512 -m 4 -C 4 -i 4
