GREEN PRODUCT PROCUREMENT
(*1)
The EC is actively promoting the WEEE & RoHS Directives that define standards
for recycling and reuse of Waste Electrical and Electronic Equipment and for the
Restriction of the use of certain Hazardous Substances. From July 1, 2006, the
RoHS Directive will prohibit any marketing of new products containing the
restricted substances.
Increasing attention is given to issues related to the global environmental.
Toshiba Corporation recognizes environmental protection as a key management
tasks, and is doing its utmost to enhance and improve the quality and scope of its
environmental activities. In line with this, Toshiba proactively promotes Green
Procurement, and seeks to purchase and use products, parts and materials that
have low environmental impacts.
Green procurement of parts is not only confined to manufacture. The same green
parts used in manufacture must also be used as replacement parts.
LEAD-FREE SOLDER
(*2)
This product is manufactured using lead-free solder as a part of a movement
within the consumer products industry at large to be environmentally responsible.
Lead-free solder must be used in the servicing and repair of this product.
WARNING
This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !
The melting temperature of lead-free solder is higher than that of leaded solder
by 86°F to 104°F (30°C to 40°C). Use of a soldering iron designed for lead-based
solders to repair product made with lead-free solder may result in damage to the
component and or PCB being soldered. Great care should be made to ensure
high-quality soldering when servicing this product — especially when soldering
large components, through-hole pins, and on PCBs — as the level of heat
required to melt lead-free solder is high.
Содержание 15DV703R
Страница 1: ...FILE No 810 201090GR ...
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Страница 3: ...R ...
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Страница 47: ...44 Important Take note of the spring orientation when reassembling the TV Main board Power board ...
Страница 48: ... ˈ ˉ ˆ ˊ ˇ ˆ ˈ ˋ ˊ ˈ ˉ ˌ ˇ 15DV703R ˆ ˉ ˇ 5 Expladed Diagram 45 ...
Страница 50: ...47 19DV703R ˌ ˇ ˆ ˋ ˋ ˉ ˆ ˌ ˊ ˊ ˈ ˆ ˊ ˉ ˈ ˉ ˇ ˈ ...
Страница 52: ...4 19DV704R ˆ ˇ ˆ ˆˇ ˊ ˋ ˋ ˌ ˉ ˆ ˉ ˆ ˌ ˊ ˋ ˊ ˇ ˈ ˈ ˌ ...
Страница 54: ...49 ˈ ˇ ˈ ˉ ˉ ˋ ˌ ˊ ˉ ˆ ˌ ˊ ˇ ˊ ˆ ˈ ˋ ˇ 22DV703R ...
Страница 56: ...50 ˈ ˆ ˉ ˆ ˊ ˆˇ ˊ ˊ ˋ ˌ ˇ ˆ ˈ ˋ ˌ ˋ ˊ ˈ ˉ ˌ ˇ 22DV704R ...
Страница 58: ...51 ˈ ˆ ˉ ˆ ˊ ˆ ˋ ˌ ˇ ˆ ˈ ˋ ˋ ˊ ˈ ˉ ˌ ˇ 26DV703R ˆ ˆ ˉ ˇ ˌ ˇ ...
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Страница 62: ...55 6 Packing Diagrams 15DV703R ...
Страница 63: ...56 19DV703R 19DV704R ...
Страница 64: ...57 22DV703R 22DV704R ...
Страница 65: ...58 26DV703R ...
Страница 66: ...59 32DV703R ...
Страница 68: ...61 DVD Module ...
Страница 71: ...64 8 Printed Circuit Board Top Trace ...
Страница 72: ...65 Top Component ...
Страница 73: ...66 Bottom Trace ...
Страница 74: ...67 Bottom Component ...
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